{"id":17628,"date":"2019-04-13T18:57:56","date_gmt":"2019-04-13T16:57:56","guid":{"rendered":"https:\/\/cohu.xcerra.com\/?page_id=17628"},"modified":"2025-12-16T06:43:12","modified_gmt":"2025-12-16T14:43:12","slug":"technical-papers","status":"publish","type":"page","link":"https:\/\/www.cohu.com\/expertise-technical-papers","title":{"rendered":"Technical Papers"},"content":{"rendered":"\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-2pcz7vg-d4ccd7972b293d2130a72e3cdb86a98e\">\n.avia-section.av-2pcz7vg-d4ccd7972b293d2130a72e3cdb86a98e{\nbackground-repeat:no-repeat;\nbackground-image:url(\/wp-content\/uploads\/2019\/04\/ECT-banner-product-pages-1266x56-px.jpg);\nbackground-position:50% 0%;\nbackground-attachment:scroll;\n}\n<\/style>\n<div id='av_section_1'  class='avia-section av-2pcz7vg-d4ccd7972b293d2130a72e3cdb86a98e main_color avia-section-default avia-no-border-styling  avia-builder-el-0  el_before_av_heading  avia-builder-el-first  avia-full-contain avia-bg-style-scroll container_wrap fullsize'  data-section-bg-repeat='contain'><div class='container av-section-cont-open' ><main  role=\"main\" itemprop=\"mainContentOfPage\"  class='template-page content  av-content-full alpha units'><div class='post-entry post-entry-type-page post-entry-17628'><div class='entry-content-wrapper clearfix'><\/div><\/div><\/main><!-- close content main element --><\/div><\/div><div id='after_section_1'  class='main_color av_default_container_wrap container_wrap fullsize'  ><div class='container av-section-cont-open' ><div class='template-page content  av-content-full alpha units'><div class='post-entry post-entry-type-page post-entry-17628'><div class='entry-content-wrapper clearfix'>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-1gnojq4-fece04b0aaaafe24a5d650f16462aaff\">\n#top .av-special-heading.av-1gnojq4-fece04b0aaaafe24a5d650f16462aaff{\npadding-bottom:10px;\n}\nbody .av-special-heading.av-1gnojq4-fece04b0aaaafe24a5d650f16462aaff .av-special-heading-tag .heading-char{\nfont-size:25px;\n}\n.av-special-heading.av-1gnojq4-fece04b0aaaafe24a5d650f16462aaff .av-subheading{\nfont-size:15px;\n}\n<\/style>\n<div  class='av-special-heading av-1gnojq4-fece04b0aaaafe24a5d650f16462aaff av-special-heading-h4  avia-builder-el-1  el_after_av_section  el_before_av_hr  avia-builder-el-first '><h4 class='av-special-heading-tag '  itemprop=\"headline\"  >Technical Papers<\/h4><div class=\"special-heading-border\"><div class=\"special-heading-inner-border\"><\/div><\/div><\/div>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-1h3gj98-1bcf5270558e653bf1886b737f9b66ac\">\n#top .hr.av-1h3gj98-1bcf5270558e653bf1886b737f9b66ac{\nmargin-top:2px;\nmargin-bottom:2px;\n}\n.hr.av-1h3gj98-1bcf5270558e653bf1886b737f9b66ac .hr-inner{\nwidth:50px;\n}\n<\/style>\n<div  class='hr av-1h3gj98-1bcf5270558e653bf1886b737f9b66ac hr-custom  avia-builder-el-2  el_after_av_heading  el_before_av_one_full  hr-center hr-icon-no'><span class='hr-inner inner-border-av-border-none'><span class=\"hr-inner-style\"><\/span><\/span><\/div>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-12onepo-ccfcab4e8d5672ae23bc5589ff6a00a2\">\n.flex_column.av-12onepo-ccfcab4e8d5672ae23bc5589ff6a00a2{\nborder-radius:0px 0px 0px 0px;\npadding:0px 0px 0px 0px;\n}\n<\/style>\n<div  class='flex_column av-12onepo-ccfcab4e8d5672ae23bc5589ff6a00a2 av_one_full  avia-builder-el-3  el_after_av_hr  el_before_av_two_fifth  first flex_column_div av-zero-column-padding  '     ><p>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-klsf2ndk-0e5270276bddd22cef1d95bfe2e9fb89\">\n#top .av-special-heading.av-klsf2ndk-0e5270276bddd22cef1d95bfe2e9fb89{\npadding-bottom:10px;\n}\nbody .av-special-heading.av-klsf2ndk-0e5270276bddd22cef1d95bfe2e9fb89 .av-special-heading-tag .heading-char{\nfont-size:25px;\n}\n.av-special-heading.av-klsf2ndk-0e5270276bddd22cef1d95bfe2e9fb89 .av-subheading{\nfont-size:15px;\n}\n<\/style>\n<div  class='av-special-heading av-klsf2ndk-0e5270276bddd22cef1d95bfe2e9fb89 av-special-heading-h3  avia-builder-el-4  el_before_av_hr  avia-builder-el-first  av-linked-heading'><h3 class='av-special-heading-tag '  itemprop=\"headline\"  >2025<\/h3><div class=\"special-heading-border\"><div class=\"special-heading-inner-border\"><\/div><\/div><\/div><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-1javrcs-ad04764a24088cf14d63aca1b7e534ca\">\n#top .hr.av-1javrcs-ad04764a24088cf14d63aca1b7e534ca{\nmargin-top:1px;\nmargin-bottom:1px;\n}\n.hr.av-1javrcs-ad04764a24088cf14d63aca1b7e534ca .hr-inner{\nwidth:50px;\n}\n<\/style>\n<div  class='hr av-1javrcs-ad04764a24088cf14d63aca1b7e534ca hr-custom  avia-builder-el-5  el_after_av_heading  el_before_av_textblock  hr-center hr-icon-no'><span class='hr-inner inner-border-av-border-none'><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<section  class='av_textblock_section av-68l2zg-d91b52a1468a3d37ab3a278f4e5b8208 '   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><div>\n<header><img loading=\"lazy\" decoding=\"async\" class=\"alignleft wp-image-48119 size-medium\" src=\"\/wp-content\/uploads\/2025\/10\/Boyd-Finlay-Tignis-at-Semicon-West-300x171.jpg\" alt=\"\" width=\"300\" height=\"171\" srcset=\"\/wp-content\/uploads\/2025\/10\/Boyd-Finlay-Tignis-at-Semicon-West-300x171.jpg 300w, \/wp-content\/uploads\/2025\/10\/Boyd-Finlay-Tignis-at-Semicon-West-1030x589.jpg 1030w, \/wp-content\/uploads\/2025\/10\/Boyd-Finlay-Tignis-at-Semicon-West-768x439.jpg 768w, \/wp-content\/uploads\/2025\/10\/Boyd-Finlay-Tignis-at-Semicon-West-1536x878.jpg 1536w, \/wp-content\/uploads\/2025\/10\/Boyd-Finlay-Tignis-at-Semicon-West-2048x1170.jpg 2048w, \/wp-content\/uploads\/2025\/10\/Boyd-Finlay-Tignis-at-Semicon-West-1500x857.jpg 1500w, \/wp-content\/uploads\/2025\/10\/Boyd-Finlay-Tignis-at-Semicon-West-705x403.jpg 705w\" sizes=\"auto, (max-width: 300px) 100vw, 300px\" \/><strong>Benefits Captured from a Digital Twin Platform with Integrated Machine Learning Capabilities <\/strong>| Boyd Finlay<\/header>\n<header><\/header>\n<header>In this presentation, Boyd Finlay collaborates with onsemi to discuss how a Digital Twin Platform can address process automations and smarter human workflows, ingest real-time streaming data sources from the machine and environment, and how PAICe Monitor incorporates automated data science and best known practices.\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-1akxw2k-a2ac6d94af4199433db7c1c91b2a12bb\">\n#top .hr.hr-invisible.av-1akxw2k-a2ac6d94af4199433db7c1c91b2a12bb{\nheight:20px;\n}\n<\/style>\n<div  class='hr av-1akxw2k-a2ac6d94af4199433db7c1c91b2a12bb hr-invisible  avia-builder-el-7  el_before_av_button  avia-builder-el-first '><span class='hr-inner '><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<div  class='avia-button-wrap av-rx27wc-854df4372af34ed9e5bba2c83fe65fb0-wrap avia-button-left  avia-builder-el-8  el_after_av_hr  avia-builder-el-last '>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-rx27wc-854df4372af34ed9e5bba2c83fe65fb0\">\n#top #wrap_all .avia-button.av-rx27wc-854df4372af34ed9e5bba2c83fe65fb0:hover{\nbackground-color:grey;\ncolor:white;\ntransition:all 0.4s ease-in-out;\n}\n#top #wrap_all .avia-button.av-rx27wc-854df4372af34ed9e5bba2c83fe65fb0:hover .avia-svg-icon svg:first-child{\nfill:white;\nstroke:white;\n}\n<\/style>\n<a href='\/wp-content\/uploads\/2025\/10\/SEMICON-West-2025_Boyd-Talk_Presented-Version.pdf'  class='avia-button av-rx27wc-854df4372af34ed9e5bba2c83fe65fb0 av-link-btn avia-icon_select-yes-left-icon avia-size-medium avia-position-left avia-color-theme-color avia-font-color-theme-color'  target=\"_blank\"  rel=\"noopener noreferrer\"  aria-label=\"View the Presentation\"><span class='avia_button_icon avia_button_icon_left avia-iconfont avia-font-entypo-fontello' data-av_icon='\ue80d' data-av_iconfont='entypo-fontello' ><\/span><span class='avia_iconbox_title' >View the Presentation<\/span><\/a><\/div><br \/>\n<\/header>\n<\/div>\n<div><\/div>\n<div><\/div>\n<\/div><\/section><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-1wp70ik-a92977a1806d85bfc1a8157691d5ec51\">\n#top .hr.av-1wp70ik-a92977a1806d85bfc1a8157691d5ec51{\nmargin-top:1px;\nmargin-bottom:1px;\n}\n.hr.av-1wp70ik-a92977a1806d85bfc1a8157691d5ec51 .hr-inner{\nwidth:50px;\n}\n<\/style>\n<div  class='hr av-1wp70ik-a92977a1806d85bfc1a8157691d5ec51 hr-custom  avia-builder-el-9  el_after_av_textblock  el_before_av_textblock  hr-center hr-icon-no'><span class='hr-inner inner-border-av-border-none'><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<section  class='av_textblock_section av-1yvudj0-10f38d41fcdad5c73f4b41aa2d8beac2 '   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><div>\n<header><img loading=\"lazy\" decoding=\"async\" class=\"wp-image-47494 alignleft\" src=\"\/wp-content\/uploads\/2025\/07\/JinSoo-Ko-at-KTC-2025-180x180.jpg\" alt=\"\" width=\"213\" height=\"213\" srcset=\"\/wp-content\/uploads\/2025\/07\/JinSoo-Ko-at-KTC-2025-180x180.jpg 180w, \/wp-content\/uploads\/2025\/07\/JinSoo-Ko-at-KTC-2025-300x300.jpg 300w, \/wp-content\/uploads\/2025\/07\/JinSoo-Ko-at-KTC-2025-1030x1030.jpg 1030w, \/wp-content\/uploads\/2025\/07\/JinSoo-Ko-at-KTC-2025-80x80.jpg 80w, \/wp-content\/uploads\/2025\/07\/JinSoo-Ko-at-KTC-2025-768x768.jpg 768w, \/wp-content\/uploads\/2025\/07\/JinSoo-Ko-at-KTC-2025-1536x1536.jpg 1536w, \/wp-content\/uploads\/2025\/07\/JinSoo-Ko-at-KTC-2025-2048x2048.jpg 2048w, \/wp-content\/uploads\/2025\/07\/JinSoo-Ko-at-KTC-2025-36x36.jpg 36w, \/wp-content\/uploads\/2025\/07\/JinSoo-Ko-at-KTC-2025-1500x1500.jpg 1500w, \/wp-content\/uploads\/2025\/07\/JinSoo-Ko-at-KTC-2025-705x705.jpg 705w\" sizes=\"auto, (max-width: 213px) 100vw, 213px\" \/><strong>Improving DDIC Signal Capture Accuracy via simulation-based compensation for Parasitic Capacitance <\/strong>| James JinSoo Ko<\/header>\n<header><\/header>\n<header>In this presentation, JinSoo Ko discusses how a SPICE (Simulation Program with Integrated Circuit Emphasis) simulation technique measures signal line parasitic capacitance accurately and mathematically to compensate it out from captured data and derive the correct DDIC source driver output load capacitance.\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-1r4di64-7d84d5a8a2fcddf2d25211bbddb5853d\">\n#top .hr.hr-invisible.av-1r4di64-7d84d5a8a2fcddf2d25211bbddb5853d{\nheight:20px;\n}\n<\/style>\n<div  class='hr av-1r4di64-7d84d5a8a2fcddf2d25211bbddb5853d hr-invisible  avia-builder-el-11  el_before_av_button  avia-builder-el-first '><span class='hr-inner '><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<div  class='avia-button-wrap av-1av8ou4-69e1326fa8c219cc79d627d510b6ed55-wrap avia-button-left  avia-builder-el-12  el_after_av_hr  avia-builder-el-last '>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-1av8ou4-69e1326fa8c219cc79d627d510b6ed55\">\n#top #wrap_all .avia-button.av-1av8ou4-69e1326fa8c219cc79d627d510b6ed55:hover{\nbackground-color:grey;\ncolor:white;\ntransition:all 0.4s ease-in-out;\n}\n#top #wrap_all .avia-button.av-1av8ou4-69e1326fa8c219cc79d627d510b6ed55:hover .avia-svg-icon svg:first-child{\nfill:white;\nstroke:white;\n}\n<\/style>\n<a href='\/wp-content\/uploads\/2025\/07\/KTC_2025_DDIC_Source_Cap_test-by-Jin-Soo-Ko-V3.0.pdf'  class='avia-button av-1av8ou4-69e1326fa8c219cc79d627d510b6ed55 av-link-btn avia-icon_select-yes-left-icon avia-size-medium avia-position-left avia-color-theme-color avia-font-color-theme-color'  target=\"_blank\"  rel=\"noopener noreferrer\"  aria-label=\"View the Presentation\"><span class='avia_button_icon avia_button_icon_left avia-iconfont avia-font-entypo-fontello' data-av_icon='\ue80d' data-av_iconfont='entypo-fontello' ><\/span><span class='avia_iconbox_title' >View the Presentation<\/span><\/a><\/div><br \/>\n<\/header>\n<\/div>\n<div><\/div>\n<div><\/div>\n<\/div><\/section><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-rhit0c-a0477f3b2e3ab9f27f22282ef0bf833e\">\n#top .hr.av-rhit0c-a0477f3b2e3ab9f27f22282ef0bf833e{\nmargin-top:1px;\nmargin-bottom:1px;\n}\n.hr.av-rhit0c-a0477f3b2e3ab9f27f22282ef0bf833e .hr-inner{\nwidth:50px;\n}\n<\/style>\n<div  class='hr av-rhit0c-a0477f3b2e3ab9f27f22282ef0bf833e hr-custom  avia-builder-el-13  el_after_av_textblock  el_before_av_textblock  hr-center hr-icon-no'><span class='hr-inner inner-border-av-border-none'><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<section  class='av_textblock_section av-jwubn2ty-1c6652543355b686c7da03bffd0502ab '   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><div>\n<header><img loading=\"lazy\" decoding=\"async\" class=\"wp-image-45184 size-medium alignleft\" src=\"\/wp-content\/uploads\/2025\/03\/semicon-korea-2025-Wai-Kong-Chen-300x171.jpg\" alt=\"\" width=\"300\" height=\"171\" srcset=\"\/wp-content\/uploads\/2025\/03\/semicon-korea-2025-Wai-Kong-Chen-300x171.jpg 300w, \/wp-content\/uploads\/2025\/03\/semicon-korea-2025-Wai-Kong-Chen-1030x588.jpg 1030w, \/wp-content\/uploads\/2025\/03\/semicon-korea-2025-Wai-Kong-Chen-768x439.jpg 768w, \/wp-content\/uploads\/2025\/03\/semicon-korea-2025-Wai-Kong-Chen-1536x878.jpg 1536w, \/wp-content\/uploads\/2025\/03\/semicon-korea-2025-Wai-Kong-Chen-2048x1170.jpg 2048w, \/wp-content\/uploads\/2025\/03\/semicon-korea-2025-Wai-Kong-Chen-1500x857.jpg 1500w, \/wp-content\/uploads\/2025\/03\/semicon-korea-2025-Wai-Kong-Chen-705x403.jpg 705w\" sizes=\"auto, (max-width: 300px) 100vw, 300px\" \/><strong>Optimizing Waveform fidelity in SERDES &amp; Other high-speed digital application <\/strong>| Wai-Kong Chen<\/header>\n<header><\/header>\n<header>In this presentation, Wai-Kong Chen discusses DDIC market trends, the types of pre-emphasis including analog and digital, pre-emphasis use model concept, and how pre-emphasis setting is incorporated in Cohu&#8217;s high-speed digital instruments.\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-znxnng-20d77fda542d5af250dcca5dda434093\">\n#top .hr.hr-invisible.av-znxnng-20d77fda542d5af250dcca5dda434093{\nheight:20px;\n}\n<\/style>\n<div  class='hr av-znxnng-20d77fda542d5af250dcca5dda434093 hr-invisible  avia-builder-el-15  el_before_av_button  avia-builder-el-first '><span class='hr-inner '><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<div  class='avia-button-wrap av-kquiu4-e14bc06d7ee108a43e5519db05a0ce94-wrap avia-button-left  avia-builder-el-16  el_after_av_hr  avia-builder-el-last '>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-kquiu4-e14bc06d7ee108a43e5519db05a0ce94\">\n#top #wrap_all .avia-button.av-kquiu4-e14bc06d7ee108a43e5519db05a0ce94:hover{\nbackground-color:grey;\ncolor:white;\ntransition:all 0.4s ease-in-out;\n}\n#top #wrap_all .avia-button.av-kquiu4-e14bc06d7ee108a43e5519db05a0ce94:hover .avia-svg-icon svg:first-child{\nfill:white;\nstroke:white;\n}\n<\/style>\n<a href='https:\/\/www.cohu.com\/wp-content\/uploads\/2025\/03\/Semicon-Korea-techincal-forum-2025.pdf'  class='avia-button av-kquiu4-e14bc06d7ee108a43e5519db05a0ce94 av-link-btn avia-icon_select-yes-left-icon avia-size-medium avia-position-left avia-color-theme-color avia-font-color-theme-color'  target=\"_blank\"  rel=\"noopener noreferrer\"  aria-label=\"View the Presentation\"><span class='avia_button_icon avia_button_icon_left avia-iconfont avia-font-entypo-fontello' data-av_icon='\ue80d' data-av_iconfont='entypo-fontello' ><\/span><span class='avia_iconbox_title' >View the Presentation<\/span><\/a><\/div><br \/>\n<\/header>\n<\/div>\n<div><\/div>\n<div><\/div>\n<\/div><\/section><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-2hp9dmk-bb66d6d167becd72ca89e015d98d8bae\">\n#top .av-special-heading.av-2hp9dmk-bb66d6d167becd72ca89e015d98d8bae{\npadding-bottom:10px;\n}\nbody .av-special-heading.av-2hp9dmk-bb66d6d167becd72ca89e015d98d8bae .av-special-heading-tag .heading-char{\nfont-size:25px;\n}\n.av-special-heading.av-2hp9dmk-bb66d6d167becd72ca89e015d98d8bae .av-subheading{\nfont-size:15px;\n}\n<\/style>\n<div  class='av-special-heading av-2hp9dmk-bb66d6d167becd72ca89e015d98d8bae av-special-heading-h3  avia-builder-el-17  el_after_av_textblock  el_before_av_hr  av-linked-heading'><h3 class='av-special-heading-tag '  itemprop=\"headline\"  >2024<\/h3><div class=\"special-heading-border\"><div class=\"special-heading-inner-border\"><\/div><\/div><\/div><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-22vqufw-cd2837aa8b6216cc618e7eb236c4df3a\">\n#top .hr.av-22vqufw-cd2837aa8b6216cc618e7eb236c4df3a{\nmargin-top:1px;\nmargin-bottom:1px;\n}\n.hr.av-22vqufw-cd2837aa8b6216cc618e7eb236c4df3a .hr-inner{\nwidth:50px;\n}\n<\/style>\n<div  class='hr av-22vqufw-cd2837aa8b6216cc618e7eb236c4df3a hr-custom  avia-builder-el-18  el_after_av_heading  el_before_av_textblock  hr-center hr-icon-no'><span class='hr-inner inner-border-av-border-none'><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<section  class='av_textblock_section av-7mrxa4-b4cbf537d43e5d51c2f8b9b1c6d7a665 '   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><div>\n<header><a href=\"https:\/\/www.cohu.com\/wp-content\/uploads\/2025\/02\/3.\uace0\uc9c4\uc218_Semiconductor-Test-and-Market_\ud604\uc7a5\ubc1c\ud45c_TEST2024_compressed.pdf\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft wp-image-44859 size-medium\" src=\"\/wp-content\/uploads\/2025\/02\/JinSoo-presenting-at-Semicon-Korea-2024-300x171.jpg\" alt=\"\" width=\"300\" height=\"171\" srcset=\"\/wp-content\/uploads\/2025\/02\/JinSoo-presenting-at-Semicon-Korea-2024-300x171.jpg 300w, \/wp-content\/uploads\/2025\/02\/JinSoo-presenting-at-Semicon-Korea-2024-1030x588.jpg 1030w, \/wp-content\/uploads\/2025\/02\/JinSoo-presenting-at-Semicon-Korea-2024-768x439.jpg 768w, \/wp-content\/uploads\/2025\/02\/JinSoo-presenting-at-Semicon-Korea-2024-1536x878.jpg 1536w, \/wp-content\/uploads\/2025\/02\/JinSoo-presenting-at-Semicon-Korea-2024-2048x1170.jpg 2048w, \/wp-content\/uploads\/2025\/02\/JinSoo-presenting-at-Semicon-Korea-2024-1500x857.jpg 1500w, \/wp-content\/uploads\/2025\/02\/JinSoo-presenting-at-Semicon-Korea-2024-705x403.jpg 705w\" sizes=\"auto, (max-width: 300px) 100vw, 300px\" \/><\/a><strong>Key Ideas for Developing Advanced Semiconductor Test Solutions <\/strong>| James JinSoo Ko<\/header>\n<header><\/header>\n<header>In this presentation, JinSoo Ko discusses the state of the current semiconductor market, the history of electronics and semiconductor technology, the structure of automated test equipment (ATE) and advanced ATE technology.\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-57qcn0-a1131bdfdeba4d98c6d596bb2fcaaa8f\">\n#top .hr.hr-invisible.av-57qcn0-a1131bdfdeba4d98c6d596bb2fcaaa8f{\nheight:20px;\n}\n<\/style>\n<div  class='hr av-57qcn0-a1131bdfdeba4d98c6d596bb2fcaaa8f hr-invisible  avia-builder-el-20  el_before_av_button  avia-builder-el-first '><span class='hr-inner '><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<div  class='avia-button-wrap av-18eco7w-c1a7eb0a79dbf2e7efb64ba7ad4dac05-wrap avia-button-left  avia-builder-el-21  el_after_av_hr  avia-builder-el-last '>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-18eco7w-c1a7eb0a79dbf2e7efb64ba7ad4dac05\">\n#top #wrap_all .avia-button.av-18eco7w-c1a7eb0a79dbf2e7efb64ba7ad4dac05:hover{\nbackground-color:grey;\ncolor:white;\ntransition:all 0.4s ease-in-out;\n}\n#top #wrap_all .avia-button.av-18eco7w-c1a7eb0a79dbf2e7efb64ba7ad4dac05:hover .avia-svg-icon svg:first-child{\nfill:white;\nstroke:white;\n}\n<\/style>\n<a href='https:\/\/www.cohu.com\/wp-content\/uploads\/2025\/02\/3.\uace0\uc9c4\uc218_Semiconductor-Test-and-Market_\ud604\uc7a5\ubc1c\ud45c_TEST2024_compressed.pdf'  class='avia-button av-18eco7w-c1a7eb0a79dbf2e7efb64ba7ad4dac05 av-link-btn avia-icon_select-yes-left-icon avia-size-medium avia-position-left avia-color-theme-color avia-font-color-theme-color'  target=\"_blank\"  rel=\"noopener noreferrer\"  aria-label=\"View the Presentation\"><span class='avia_button_icon avia_button_icon_left avia-iconfont avia-font-entypo-fontello' data-av_icon='\ue80d' data-av_iconfont='entypo-fontello' ><\/span><span class='avia_iconbox_title' >View the Presentation<\/span><\/a><\/div><br \/>\n<\/header>\n<\/div>\n<div><\/div>\n<div><\/div>\n<\/div><\/section><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-j4mbvg-8b1e2fba7d08ca99949945519a4a8b5d\">\n#top .hr.av-j4mbvg-8b1e2fba7d08ca99949945519a4a8b5d{\nmargin-top:1px;\nmargin-bottom:1px;\n}\n.hr.av-j4mbvg-8b1e2fba7d08ca99949945519a4a8b5d .hr-inner{\nwidth:50px;\n}\n<\/style>\n<div  class='hr av-j4mbvg-8b1e2fba7d08ca99949945519a4a8b5d hr-custom  avia-builder-el-22  el_after_av_textblock  el_before_av_textblock  hr-center hr-icon-no'><span class='hr-inner inner-border-av-border-none'><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<section  class='av_textblock_section av-m7f5gsjs-0dd4163d1a3ed32e9e2b71652fe05e9b '   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><div>\n<header><a href=\"https:\/\/www.cohu.com\/wp-content\/uploads\/2025\/02\/2024-KTC_Paper-JinSoo-Ko-V7.0.doc\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft wp-image-44863\" src=\"\/wp-content\/uploads\/2025\/02\/JinSoo-Ko-at-KTC-2024-180x180.jpg\" alt=\"\" width=\"206\" height=\"206\" srcset=\"\/wp-content\/uploads\/2025\/02\/JinSoo-Ko-at-KTC-2024-180x180.jpg 180w, \/wp-content\/uploads\/2025\/02\/JinSoo-Ko-at-KTC-2024-300x300.jpg 300w, \/wp-content\/uploads\/2025\/02\/JinSoo-Ko-at-KTC-2024-1030x1030.jpg 1030w, \/wp-content\/uploads\/2025\/02\/JinSoo-Ko-at-KTC-2024-80x80.jpg 80w, \/wp-content\/uploads\/2025\/02\/JinSoo-Ko-at-KTC-2024-768x768.jpg 768w, \/wp-content\/uploads\/2025\/02\/JinSoo-Ko-at-KTC-2024-1536x1536.jpg 1536w, \/wp-content\/uploads\/2025\/02\/JinSoo-Ko-at-KTC-2024-2048x2048.jpg 2048w, \/wp-content\/uploads\/2025\/02\/JinSoo-Ko-at-KTC-2024-36x36.jpg 36w, \/wp-content\/uploads\/2025\/02\/JinSoo-Ko-at-KTC-2024-1500x1500.jpg 1500w, \/wp-content\/uploads\/2025\/02\/JinSoo-Ko-at-KTC-2024-705x705.jpg 705w\" sizes=\"auto, (max-width: 206px) 100vw, 206px\" \/><\/a><strong>Managing Measurement Path Capacitance in DDIC Source Channel Testing <\/strong>| James JinSoo Ko<\/header>\n<header><\/header>\n<header>In this presentation, JinSoo Ko discusses a solution to improve capacitance changes between capture channels, including load board signal lines, by adjusting the capacitance directly on the channel card or load board, or by mathematically compensating the source signal data using automatic channel capacitance diagnosis technology.\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-1zwktjw-6013e2500e2f4e9345a3052214653ddd\">\n#top .hr.hr-invisible.av-1zwktjw-6013e2500e2f4e9345a3052214653ddd{\nheight:20px;\n}\n<\/style>\n<div  class='hr av-1zwktjw-6013e2500e2f4e9345a3052214653ddd hr-invisible  avia-builder-el-24  el_before_av_button  avia-builder-el-first '><span class='hr-inner '><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<div  class='avia-button-wrap av-1nqbn5o-077125de26f173917b174f4b5617c2e1-wrap avia-button-left  avia-builder-el-25  el_after_av_hr  avia-builder-el-last '>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-1nqbn5o-077125de26f173917b174f4b5617c2e1\">\n#top #wrap_all .avia-button.av-1nqbn5o-077125de26f173917b174f4b5617c2e1:hover{\nbackground-color:grey;\ncolor:white;\ntransition:all 0.4s ease-in-out;\n}\n#top #wrap_all .avia-button.av-1nqbn5o-077125de26f173917b174f4b5617c2e1:hover .avia-svg-icon svg:first-child{\nfill:white;\nstroke:white;\n}\n<\/style>\n<a href='https:\/\/www.cohu.com\/wp-content\/uploads\/2025\/02\/2024-KTC_Paper-JinSoo-Ko-V7.0.doc'  class='avia-button av-1nqbn5o-077125de26f173917b174f4b5617c2e1 av-link-btn avia-icon_select-yes-left-icon avia-size-medium avia-position-left avia-color-theme-color avia-font-color-theme-color'  target=\"_blank\"  rel=\"noopener noreferrer\"  aria-label=\"View the Presentation\"><span class='avia_button_icon avia_button_icon_left avia-iconfont avia-font-entypo-fontello' data-av_icon='\ue80d' data-av_iconfont='entypo-fontello' ><\/span><span class='avia_iconbox_title' >View the Presentation<\/span><\/a><\/div><br \/>\n<\/header>\n<\/div>\n<div><\/div>\n<div><\/div>\n<\/div><\/section><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-m7ydzw-80249acee3f05fd15e7b0c4f9ce1bb37\">\n#top .hr.av-m7ydzw-80249acee3f05fd15e7b0c4f9ce1bb37{\nmargin-top:1px;\nmargin-bottom:1px;\n}\n.hr.av-m7ydzw-80249acee3f05fd15e7b0c4f9ce1bb37 .hr-inner{\nwidth:50px;\n}\n<\/style>\n<div  class='hr av-m7ydzw-80249acee3f05fd15e7b0c4f9ce1bb37 hr-custom  avia-builder-el-26  el_after_av_textblock  el_before_av_heading  hr-center hr-icon-no'><span class='hr-inner inner-border-av-border-none'><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-2kefbjw-93ee9a7abe9fa005823c4af5faed8192\">\n#top .av-special-heading.av-2kefbjw-93ee9a7abe9fa005823c4af5faed8192{\npadding-bottom:10px;\n}\nbody .av-special-heading.av-2kefbjw-93ee9a7abe9fa005823c4af5faed8192 .av-special-heading-tag .heading-char{\nfont-size:25px;\n}\n.av-special-heading.av-2kefbjw-93ee9a7abe9fa005823c4af5faed8192 .av-subheading{\nfont-size:15px;\n}\n<\/style>\n<div  class='av-special-heading av-2kefbjw-93ee9a7abe9fa005823c4af5faed8192 av-special-heading-h3  avia-builder-el-27  el_after_av_hr  el_before_av_hr  av-linked-heading'><h3 class='av-special-heading-tag '  itemprop=\"headline\"  >2023<\/h3><div class=\"special-heading-border\"><div class=\"special-heading-inner-border\"><\/div><\/div><\/div><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-24rz4d8-ab920600c1e06a47bb1553da5d473716\">\n#top .hr.av-24rz4d8-ab920600c1e06a47bb1553da5d473716{\nmargin-top:1px;\nmargin-bottom:1px;\n}\n.hr.av-24rz4d8-ab920600c1e06a47bb1553da5d473716 .hr-inner{\nwidth:50px;\n}\n<\/style>\n<div  class='hr av-24rz4d8-ab920600c1e06a47bb1553da5d473716 hr-custom  avia-builder-el-28  el_after_av_heading  el_before_av_textblock  hr-center hr-icon-no'><span class='hr-inner inner-border-av-border-none'><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<section  class='av_textblock_section av-1t56tgc-511144350cc041625d9d61349708dfe2 '   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><div>\n<header><a href=\"https:\/\/youtu.be\/zsBgOCl5zKs?si=EKlg_AGY781iNxNv\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft wp-image-41402 size-medium\" src=\"\/wp-content\/uploads\/2023\/07\/MSTC-Nigel-B-300x171.jpg\" alt=\"Cohu's Nigel Beddoe will be presenting a paper about Solving the problem of internal and external noise impact on testing high sensitivity MEMS and sensors at the MEMS and Sensors Technical Congress. There is a rendering of a person's face in shadow and sound waves coming out of their mouth on the left side.\" width=\"300\" height=\"171\" srcset=\"\/wp-content\/uploads\/2023\/07\/MSTC-Nigel-B-300x171.jpg 300w, \/wp-content\/uploads\/2023\/07\/MSTC-Nigel-B-1030x589.jpg 1030w, \/wp-content\/uploads\/2023\/07\/MSTC-Nigel-B-768x439.jpg 768w, \/wp-content\/uploads\/2023\/07\/MSTC-Nigel-B-1536x878.jpg 1536w, \/wp-content\/uploads\/2023\/07\/MSTC-Nigel-B-2048x1170.jpg 2048w, \/wp-content\/uploads\/2023\/07\/MSTC-Nigel-B-1500x857.jpg 1500w, \/wp-content\/uploads\/2023\/07\/MSTC-Nigel-B-705x403.jpg 705w\" sizes=\"auto, (max-width: 300px) 100vw, 300px\" \/><\/a><strong>Solving the Problem of Internal and External Noise on Impact on Testing High Sensitivity MEMS and Sensors <\/strong>| Nigel Beddoe<\/header>\n<header><\/header>\n<header>In this presentation, Nigel Beddoe discusses the effect of noise on sensitive MEMS devices and how to test these devices, focusing on sensitive MEMS device testing requirements to create optimized testing by eliminated noise and vibration. Nigel&#8217;s presentation was the MSTC 2023 Product Showdown runner-up winner.\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-10x4ggs-ea551eebe10f8cce4bd28b766c50412d\">\n#top .hr.hr-invisible.av-10x4ggs-ea551eebe10f8cce4bd28b766c50412d{\nheight:20px;\n}\n<\/style>\n<div  class='hr av-10x4ggs-ea551eebe10f8cce4bd28b766c50412d hr-invisible  avia-builder-el-30  el_before_av_button  avia-builder-el-first '><span class='hr-inner '><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<div  class='avia-button-wrap av-kprxy4-5202e183fb08b7fed6f8dc82c6805adc-wrap avia-button-left  avia-builder-el-31  el_after_av_hr  avia-builder-el-last '>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-kprxy4-5202e183fb08b7fed6f8dc82c6805adc\">\n#top #wrap_all .avia-button.av-kprxy4-5202e183fb08b7fed6f8dc82c6805adc:hover{\nbackground-color:grey;\ncolor:white;\ntransition:all 0.4s ease-in-out;\n}\n#top #wrap_all .avia-button.av-kprxy4-5202e183fb08b7fed6f8dc82c6805adc:hover .avia-svg-icon svg:first-child{\nfill:white;\nstroke:white;\n}\n<\/style>\n<a href='https:\/\/youtu.be\/zsBgOCl5zKs?si=EKlg_AGY781iNxNv'  class='avia-button av-kprxy4-5202e183fb08b7fed6f8dc82c6805adc av-link-btn avia-icon_select-yes-left-icon avia-size-medium avia-position-left avia-color-theme-color avia-font-color-theme-color'  target=\"_blank\"  rel=\"noopener noreferrer\"  aria-label=\"Watch on YouTube Channel\"><span class='avia_button_icon avia_button_icon_left avia-iconfont avia-font-entypo-fontello' data-av_icon='\ue80d' data-av_iconfont='entypo-fontello' ><\/span><span class='avia_iconbox_title' >Watch on YouTube Channel<\/span><\/a><\/div><br \/>\n<\/header>\n<\/div>\n<div><\/div>\n<div><\/div>\n<\/div><\/section><br \/>\n<section  class='av_textblock_section av-1pz6b3w-0198de8386a226a641747883fbae951f '   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><div>\n<header><a href=\"\/wp-content\/uploads\/2023\/06\/Adam-Schultz-Hydra-Poster-session.pdf\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft wp-image-41245 size-medium\" src=\"\/wp-content\/uploads\/2023\/04\/Adam-Schultz-SWTest-2023-sm-300x171.jpg\" alt=\"\" width=\"300\" height=\"171\" srcset=\"\/wp-content\/uploads\/2023\/04\/Adam-Schultz-SWTest-2023-sm-300x171.jpg 300w, \/wp-content\/uploads\/2023\/04\/Adam-Schultz-SWTest-2023-sm-1030x589.jpg 1030w, \/wp-content\/uploads\/2023\/04\/Adam-Schultz-SWTest-2023-sm-768x439.jpg 768w, \/wp-content\/uploads\/2023\/04\/Adam-Schultz-SWTest-2023-sm-1536x878.jpg 1536w, \/wp-content\/uploads\/2023\/04\/Adam-Schultz-SWTest-2023-sm-2048x1170.jpg 2048w, \/wp-content\/uploads\/2023\/04\/Adam-Schultz-SWTest-2023-sm-1500x857.jpg 1500w, \/wp-content\/uploads\/2023\/04\/Adam-Schultz-SWTest-2023-sm-705x403.jpg 705w\" sizes=\"auto, (max-width: 300px) 100vw, 300px\" \/><\/a><strong>Simplifying the Process of Probe Card Design through Software Automation <\/strong>| Adam Schultz<\/header>\n<header><\/header>\n<header>In this presentation, Adam Schultz discusses an approach to automating RF simulation for probe cards which significantly reduces simulation errors, lead time, and cost. This poster was presented at SWTest 2023 and was named Winner of 2023 Best Poster.\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-1b4erjw-cd5529da34e92ffa323f8c26dee5bd46\">\n#top .hr.hr-invisible.av-1b4erjw-cd5529da34e92ffa323f8c26dee5bd46{\nheight:20px;\n}\n<\/style>\n<div  class='hr av-1b4erjw-cd5529da34e92ffa323f8c26dee5bd46 hr-invisible  avia-builder-el-33  el_before_av_button  avia-builder-el-first '><span class='hr-inner '><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<div  class='avia-button-wrap av-t9iwjg-7c3b7d18d706f1c1e29f4829d95f9fc5-wrap avia-button-left  avia-builder-el-34  el_after_av_hr  avia-builder-el-last '>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-t9iwjg-7c3b7d18d706f1c1e29f4829d95f9fc5\">\n#top #wrap_all .avia-button.av-t9iwjg-7c3b7d18d706f1c1e29f4829d95f9fc5:hover{\nbackground-color:grey;\ncolor:white;\ntransition:all 0.4s ease-in-out;\n}\n#top #wrap_all .avia-button.av-t9iwjg-7c3b7d18d706f1c1e29f4829d95f9fc5:hover .avia-svg-icon svg:first-child{\nfill:white;\nstroke:white;\n}\n<\/style>\n<a href='\/wp-content\/uploads\/2023\/06\/Adam-Schultz-Hydra-Poster-session.pdf'  class='avia-button av-t9iwjg-7c3b7d18d706f1c1e29f4829d95f9fc5 av-link-btn avia-icon_select-yes-left-icon avia-size-medium avia-position-left avia-color-theme-color avia-font-color-theme-color'  target=\"_blank\"  rel=\"noopener noreferrer\"  aria-label=\"View the Presentation\"><span class='avia_button_icon avia_button_icon_left avia-iconfont avia-font-entypo-fontello' data-av_icon='\ue80d' data-av_iconfont='entypo-fontello' ><\/span><span class='avia_iconbox_title' >View the Presentation<\/span><\/a><\/div><br \/>\n<\/header>\n<\/div>\n<div><\/div>\n<div><\/div>\n<\/div><\/section><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-1b170vw-c0eb13df556ed5b703c897eef2fd8bb5\">\n#top .hr.av-1b170vw-c0eb13df556ed5b703c897eef2fd8bb5{\nmargin-top:1px;\nmargin-bottom:1px;\n}\n.hr.av-1b170vw-c0eb13df556ed5b703c897eef2fd8bb5 .hr-inner{\nwidth:50px;\n}\n<\/style>\n<div  class='hr av-1b170vw-c0eb13df556ed5b703c897eef2fd8bb5 hr-custom  avia-builder-el-35  el_after_av_textblock  el_before_av_textblock  hr-center hr-icon-no'><span class='hr-inner inner-border-av-border-none'><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<section  class='av_textblock_section av-1hxtn3w-609a44f3e4f735e8aa95daa393299eec '   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><div>\n<header><a href=\"\/wp-content\/uploads\/2023\/03\/Cohu_TestConX2023_Thermal_Challenges.pdf\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft wp-image-40935 size-medium\" src=\"\/wp-content\/uploads\/2023\/02\/Testconx-2023-Ernest-300x171.jpg\" alt=\"\" width=\"300\" height=\"171\" srcset=\"\/wp-content\/uploads\/2023\/02\/Testconx-2023-Ernest-300x171.jpg 300w, \/wp-content\/uploads\/2023\/02\/Testconx-2023-Ernest-1030x589.jpg 1030w, \/wp-content\/uploads\/2023\/02\/Testconx-2023-Ernest-768x439.jpg 768w, \/wp-content\/uploads\/2023\/02\/Testconx-2023-Ernest-1536x878.jpg 1536w, \/wp-content\/uploads\/2023\/02\/Testconx-2023-Ernest-2048x1170.jpg 2048w, \/wp-content\/uploads\/2023\/02\/Testconx-2023-Ernest-1500x857.jpg 1500w, \/wp-content\/uploads\/2023\/02\/Testconx-2023-Ernest-705x403.jpg 705w\" sizes=\"auto, (max-width: 300px) 100vw, 300px\" \/><\/a><strong>Thermal and Mechanical Challenges of Test Handlers <\/strong>| Ernest Blanco<br \/>\nIn this presentation Ernest Blanco addresses several challenges relating to testing IC devices and the need for more robust pick and place processes along with the precision alignment of the device under test (DUT) to the contact pines.This paper was presented at TestConX 2023.<\/p>\n<p>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-10spul8-d813c0f1b12f3a5ce79fc7a1fdff28e4\">\n#top .hr.hr-invisible.av-10spul8-d813c0f1b12f3a5ce79fc7a1fdff28e4{\nheight:20px;\n}\n<\/style>\n<div  class='hr av-10spul8-d813c0f1b12f3a5ce79fc7a1fdff28e4 hr-invisible  avia-builder-el-37  el_before_av_button  avia-builder-el-first '><span class='hr-inner '><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<div  class='avia-button-wrap av-itb3do-80ebffc698124ddcf2f527b3d39d7df2-wrap avia-button-left  avia-builder-el-38  el_after_av_hr  avia-builder-el-last '>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-itb3do-80ebffc698124ddcf2f527b3d39d7df2\">\n#top #wrap_all .avia-button.av-itb3do-80ebffc698124ddcf2f527b3d39d7df2:hover{\nbackground-color:grey;\ncolor:white;\ntransition:all 0.4s ease-in-out;\n}\n#top #wrap_all .avia-button.av-itb3do-80ebffc698124ddcf2f527b3d39d7df2:hover .avia-svg-icon svg:first-child{\nfill:white;\nstroke:white;\n}\n<\/style>\n<a href='\/wp-content\/uploads\/2023\/03\/Cohu_TestConX2023_Thermal_Challenges.pdf'  class='avia-button av-itb3do-80ebffc698124ddcf2f527b3d39d7df2 av-link-btn avia-icon_select-yes-left-icon avia-size-medium avia-position-left avia-color-theme-color avia-font-color-theme-color'  target=\"_blank\"  rel=\"noopener noreferrer\"  aria-label=\"View the Presentation\"><span class='avia_button_icon avia_button_icon_left avia-iconfont avia-font-entypo-fontello' data-av_icon='\ue80d' data-av_iconfont='entypo-fontello' ><\/span><span class='avia_iconbox_title' >View the Presentation<\/span><\/a><\/div><br \/>\n<\/header>\n<\/div>\n<div><\/div>\n<div><\/div>\n<\/div><\/section><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-1lg1jcs-d51cc9381558b57f9c0e36c24937e5bf\">\n#top .hr.av-1lg1jcs-d51cc9381558b57f9c0e36c24937e5bf{\nmargin-top:2px;\nmargin-bottom:2px;\n}\n.hr.av-1lg1jcs-d51cc9381558b57f9c0e36c24937e5bf .hr-inner{\nwidth:50px;\n}\n<\/style>\n<div  class='hr av-1lg1jcs-d51cc9381558b57f9c0e36c24937e5bf hr-custom  avia-builder-el-39  el_after_av_textblock  el_before_av_textblock  hr-center hr-icon-no'><span class='hr-inner inner-border-av-border-none'><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<section  class='av_textblock_section av-1igini4-8fa469e0e26a7fba0dae26e84eef6ad8 '   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><div>\n<header>\n<div class=\"wp-block-image\"><a href=\"\/wp-content\/uploads\/2023\/03\/Cohu-2023-Semicon-Korea-OLED-DDIC-Test-rev-b.pdf\"><img loading=\"lazy\" decoding=\"async\" class=\"wpa-warning wpa-image-missing-alt alignleft wp-image-43992 size-medium\" src=\"\/wp-content\/uploads\/2024\/09\/Chris-Lemoine-Semicon-Korea-post-300x171.jpg\" alt=\"Cohu's Chris Lemoine will be presenting a paper on High resolution OLED display driver IC testing - trends and challenges at Semicon Korea on February 1. There is a grid of 8 x 4 TVs in the background, each showing a different nature scene.\" width=\"300\" height=\"171\" data-warning=\"Missing alt text\" srcset=\"\/wp-content\/uploads\/2024\/09\/Chris-Lemoine-Semicon-Korea-post-300x171.jpg 300w, \/wp-content\/uploads\/2024\/09\/Chris-Lemoine-Semicon-Korea-post-1030x589.jpg 1030w, \/wp-content\/uploads\/2024\/09\/Chris-Lemoine-Semicon-Korea-post-768x439.jpg 768w, \/wp-content\/uploads\/2024\/09\/Chris-Lemoine-Semicon-Korea-post-1536x878.jpg 1536w, \/wp-content\/uploads\/2024\/09\/Chris-Lemoine-Semicon-Korea-post-2048x1170.jpg 2048w, \/wp-content\/uploads\/2024\/09\/Chris-Lemoine-Semicon-Korea-post-1500x857.jpg 1500w, \/wp-content\/uploads\/2024\/09\/Chris-Lemoine-Semicon-Korea-post-705x403.jpg 705w\" sizes=\"auto, (max-width: 300px) 100vw, 300px\" \/><\/a><\/div>\n<p><strong>Testing Next Generation OLED Display Driver ICs <\/strong>| Chris Lemoine<br \/>\nIn this presentation Chris Lemoine presents the trends and challenges of testing next generation OLED display driver ICs, including TDDI for mobile, home, enterprise and automotive applications. This paper was presented at Semicon Korea 2023.<\/p>\n<p>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-znxnng-7-24abc7896f760bd0d74a24765c9f4bc4\">\n#top .hr.hr-invisible.av-znxnng-7-24abc7896f760bd0d74a24765c9f4bc4{\nheight:20px;\n}\n<\/style>\n<div  class='hr av-znxnng-7-24abc7896f760bd0d74a24765c9f4bc4 hr-invisible  avia-builder-el-41  el_before_av_button  avia-builder-el-first '><span class='hr-inner '><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<div  class='avia-button-wrap av-2uexng-a93f0500af5d8419b3c4f3bec59ce99d-wrap avia-button-left  avia-builder-el-42  el_after_av_hr  avia-builder-el-last '>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-2uexng-a93f0500af5d8419b3c4f3bec59ce99d\">\n#top #wrap_all .avia-button.av-2uexng-a93f0500af5d8419b3c4f3bec59ce99d:hover{\nbackground-color:grey;\ncolor:white;\ntransition:all 0.4s ease-in-out;\n}\n#top #wrap_all .avia-button.av-2uexng-a93f0500af5d8419b3c4f3bec59ce99d:hover .avia-svg-icon svg:first-child{\nfill:white;\nstroke:white;\n}\n<\/style>\n<a href='\/wp-content\/uploads\/2023\/03\/Cohu-2023-Semicon-Korea-OLED-DDIC-Test-rev-b.pdf'  class='avia-button av-2uexng-a93f0500af5d8419b3c4f3bec59ce99d av-link-btn avia-icon_select-yes-left-icon avia-size-medium avia-position-left avia-color-theme-color avia-font-color-theme-color'  target=\"_blank\"  rel=\"noopener noreferrer\"  aria-label=\"View the Presentation\"><span class='avia_button_icon avia_button_icon_left avia-iconfont avia-font-entypo-fontello' data-av_icon='\ue80d' data-av_iconfont='entypo-fontello' ><\/span><span class='avia_iconbox_title' >View the Presentation<\/span><\/a><\/div><br \/>\n<\/header>\n<\/div>\n<div><\/div>\n<div><\/div>\n<\/div><\/section><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-k7usn0-7e794ed64cfdcbcf34ea9c554c4cfb78\">\n#top .hr.av-k7usn0-7e794ed64cfdcbcf34ea9c554c4cfb78{\nmargin-top:1px;\nmargin-bottom:1px;\n}\n.hr.av-k7usn0-7e794ed64cfdcbcf34ea9c554c4cfb78 .hr-inner{\nwidth:50px;\n}\n<\/style>\n<div  class='hr av-k7usn0-7e794ed64cfdcbcf34ea9c554c4cfb78 hr-custom  avia-builder-el-43  el_after_av_textblock  el_before_av_heading  hr-center hr-icon-no'><span class='hr-inner inner-border-av-border-none'><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-wxncs-6d0683136762dcead3984c096714687b\">\n#top .av-special-heading.av-wxncs-6d0683136762dcead3984c096714687b{\npadding-bottom:10px;\n}\nbody .av-special-heading.av-wxncs-6d0683136762dcead3984c096714687b .av-special-heading-tag .heading-char{\nfont-size:25px;\n}\n.av-special-heading.av-wxncs-6d0683136762dcead3984c096714687b .av-subheading{\nfont-size:15px;\n}\n<\/style>\n<div  class='av-special-heading av-wxncs-6d0683136762dcead3984c096714687b av-special-heading-h3  avia-builder-el-44  el_after_av_hr  el_before_av_hr  av-linked-heading'><h3 class='av-special-heading-tag '  itemprop=\"headline\"  >2022<\/h3><div class=\"special-heading-border\"><div class=\"special-heading-inner-border\"><\/div><\/div><\/div><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-21ng718-9024bda33ccbf3975d76442dc4679622\">\n#top .hr.av-21ng718-9024bda33ccbf3975d76442dc4679622{\nmargin-top:1px;\nmargin-bottom:1px;\n}\n.hr.av-21ng718-9024bda33ccbf3975d76442dc4679622 .hr-inner{\nwidth:50px;\n}\n<\/style>\n<div  class='hr av-21ng718-9024bda33ccbf3975d76442dc4679622 hr-custom  avia-builder-el-45  el_after_av_heading  el_before_av_textblock  hr-center hr-icon-no'><span class='hr-inner inner-border-av-border-none'><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<section  class='av_textblock_section av-1qnn82k-8fd369fe7179eedd9055295c4086f695 '   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><div>\n<header><img loading=\"lazy\" decoding=\"async\" class=\"wp-image-40708 size-medium alignleft\" src=\"\/wp-content\/uploads\/2022\/12\/Serge-semicon-japan-300x171.jpg\" alt=\"\" width=\"300\" height=\"171\" srcset=\"\/wp-content\/uploads\/2022\/12\/Serge-semicon-japan-300x171.jpg 300w, \/wp-content\/uploads\/2022\/12\/Serge-semicon-japan-1030x589.jpg 1030w, \/wp-content\/uploads\/2022\/12\/Serge-semicon-japan-768x439.jpg 768w, \/wp-content\/uploads\/2022\/12\/Serge-semicon-japan-1536x878.jpg 1536w, \/wp-content\/uploads\/2022\/12\/Serge-semicon-japan-2048x1170.jpg 2048w, \/wp-content\/uploads\/2022\/12\/Serge-semicon-japan-1500x857.jpg 1500w, \/wp-content\/uploads\/2022\/12\/Serge-semicon-japan-705x403.jpg 705w\" sizes=\"auto, (max-width: 300px) 100vw, 300px\" \/><strong>True Known Good Die Solution for SiC Power Die Testing <\/strong>| Serge K\u00fcnzli<br \/>\nOne of the Key elements to guarantee the quality and reliability of SiC bare dies is the capabilities to test, inspect and sort the dies after singulation and prior final assembly in power module. The NY32W Know Good Die (KGD) together with the cGator contactor and NV-Core inspection system offers an all-in-one test and inspection solution for high-power SiC bare die\u2019s providing a lower cost of test. This paper was presented at Semicon Japan 2022.<\/p>\n<p>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-12n5tp8-29815052c7b723f5e11e4e798345ad99\">\n#top .hr.hr-invisible.av-12n5tp8-29815052c7b723f5e11e4e798345ad99{\nheight:20px;\n}\n<\/style>\n<div  class='hr av-12n5tp8-29815052c7b723f5e11e4e798345ad99 hr-invisible  avia-builder-el-47  el_before_av_button  avia-builder-el-first '><span class='hr-inner '><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<div  class='avia-button-wrap av-vdbduk-9f0715490c02bd59f5c24431b08a1b5e-wrap avia-button-left  avia-builder-el-48  el_after_av_hr  avia-builder-el-last '>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-vdbduk-9f0715490c02bd59f5c24431b08a1b5e\">\n#top #wrap_all .avia-button.av-vdbduk-9f0715490c02bd59f5c24431b08a1b5e:hover{\nbackground-color:grey;\ncolor:white;\ntransition:all 0.4s ease-in-out;\n}\n#top #wrap_all .avia-button.av-vdbduk-9f0715490c02bd59f5c24431b08a1b5e:hover .avia-svg-icon svg:first-child{\nfill:white;\nstroke:white;\n}\n<\/style>\n<a href='\/wp-content\/uploads\/2023\/03\/2022-SEMI-Japan-Cohu-True-KGD-12-04-22-final-ex-video.pdf'  class='avia-button av-vdbduk-9f0715490c02bd59f5c24431b08a1b5e av-link-btn avia-icon_select-yes-left-icon avia-size-medium avia-position-left avia-color-theme-color avia-font-color-theme-color'  target=\"_blank\"  rel=\"noopener noreferrer\"  aria-label=\"View the Presentation\"><span class='avia_button_icon avia_button_icon_left avia-iconfont avia-font-entypo-fontello' data-av_icon='\ue80d' data-av_iconfont='entypo-fontello' ><\/span><span class='avia_iconbox_title' >View the Presentation<\/span><\/a><\/div><br \/>\n<\/header>\n<\/div>\n<div><\/div>\n<div><\/div>\n<\/div><\/section><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-mdqakc-a5378339a029e7b46c93a559643f33f6\">\n#top .hr.av-mdqakc-a5378339a029e7b46c93a559643f33f6{\nmargin-top:2px;\nmargin-bottom:2px;\n}\n.hr.av-mdqakc-a5378339a029e7b46c93a559643f33f6 .hr-inner{\nwidth:50px;\n}\n<\/style>\n<div  class='hr av-mdqakc-a5378339a029e7b46c93a559643f33f6 hr-custom  avia-builder-el-49  el_after_av_textblock  el_before_av_textblock  hr-center hr-icon-no'><span class='hr-inner inner-border-av-border-none'><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<section  class='av_textblock_section av-141aiu4-c52c36915bf338fad69623cbf6b1f609 '   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><div>\n<header><img loading=\"lazy\" decoding=\"async\" class=\"wp-image-40371 size-medium alignleft\" src=\"\/wp-content\/uploads\/2022\/09\/Semicon-Europa-Markus-W-300x171.jpg\" alt=\"\" width=\"300\" height=\"171\" srcset=\"\/wp-content\/uploads\/2022\/09\/Semicon-Europa-Markus-W-300x171.jpg 300w, \/wp-content\/uploads\/2022\/09\/Semicon-Europa-Markus-W-1030x589.jpg 1030w, \/wp-content\/uploads\/2022\/09\/Semicon-Europa-Markus-W-768x439.jpg 768w, \/wp-content\/uploads\/2022\/09\/Semicon-Europa-Markus-W-1536x878.jpg 1536w, \/wp-content\/uploads\/2022\/09\/Semicon-Europa-Markus-W-2048x1170.jpg 2048w, \/wp-content\/uploads\/2022\/09\/Semicon-Europa-Markus-W-1500x857.jpg 1500w, \/wp-content\/uploads\/2022\/09\/Semicon-Europa-Markus-W-705x403.jpg 705w\" sizes=\"auto, (max-width: 300px) 100vw, 300px\" \/><strong>The Challenges in Testing Small and Highly Integrated Devices in a Massive Parallel Test System<\/strong> | Markus Wagner<br \/>\nThe triumph of electronic components started in the 1950s with the introduction of semiconductor transistors. Since this time the content of electronics has risen significantly. Innovations in the semiconductor industry are supporting the megatrends like mobility car electrification including ADAS-systems, sensors, connectivity, and advanced security. In this presentation, Markus Wagner describes the development of a test contactor for singulated, small WLCSP devices in massive parallelism test, supporting more than 200 contact sites and how different aspects address the challenges of reliable and cost-efficient device testing. This paper was presented at Semicon Europa 2022.<\/p>\n<p>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-1mp8c64-6de1adfaa749bca93f088b9278bfc5c6\">\n#top .hr.hr-invisible.av-1mp8c64-6de1adfaa749bca93f088b9278bfc5c6{\nheight:20px;\n}\n<\/style>\n<div  class='hr av-1mp8c64-6de1adfaa749bca93f088b9278bfc5c6 hr-invisible  avia-builder-el-51  el_before_av_button  avia-builder-el-first '><span class='hr-inner '><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<div  class='avia-button-wrap av-j8hnb0-10a946b37c947a911dea89010745487d-wrap avia-button-left  avia-builder-el-52  el_after_av_hr  avia-builder-el-last '>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-j8hnb0-10a946b37c947a911dea89010745487d\">\n#top #wrap_all .avia-button.av-j8hnb0-10a946b37c947a911dea89010745487d:hover{\nbackground-color:grey;\ncolor:white;\ntransition:all 0.4s ease-in-out;\n}\n#top #wrap_all .avia-button.av-j8hnb0-10a946b37c947a911dea89010745487d:hover .avia-svg-icon svg:first-child{\nfill:white;\nstroke:white;\n}\n<\/style>\n<a href='\/wp-content\/uploads\/2022\/12\/04_MarkusWagner_Cohu.pdf'  class='avia-button av-j8hnb0-10a946b37c947a911dea89010745487d av-link-btn avia-icon_select-yes-left-icon avia-size-medium avia-position-left avia-color-theme-color avia-font-color-theme-color'  target=\"_blank\"  rel=\"noopener noreferrer\"  aria-label=\"View the Presentation\"><span class='avia_button_icon avia_button_icon_left avia-iconfont avia-font-entypo-fontello' data-av_icon='\ue80d' data-av_iconfont='entypo-fontello' ><\/span><span class='avia_iconbox_title' >View the Presentation<\/span><\/a><\/div><br \/>\n<\/header>\n<\/div>\n<div><\/div>\n<div><\/div>\n<\/div><\/section><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-1be8f18-2b74cb26c3fa13562d20d132489224fb\">\n#top .hr.av-1be8f18-2b74cb26c3fa13562d20d132489224fb{\nmargin-top:2px;\nmargin-bottom:2px;\n}\n.hr.av-1be8f18-2b74cb26c3fa13562d20d132489224fb .hr-inner{\nwidth:50px;\n}\n<\/style>\n<div  class='hr av-1be8f18-2b74cb26c3fa13562d20d132489224fb hr-custom  avia-builder-el-53  el_after_av_textblock  el_before_av_textblock  hr-center hr-icon-no'><span class='hr-inner inner-border-av-border-none'><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<section  class='av_textblock_section av-1n7t28s-42b16bcf1014332d884dc1d16decce00 '   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><div>\n<header><img loading=\"lazy\" decoding=\"async\" class=\"wp-image-40372 size-medium alignleft\" src=\"\/wp-content\/uploads\/2022\/09\/Semicon-Europa-Peter-C-300x171.jpg\" alt=\"\" width=\"300\" height=\"171\" srcset=\"\/wp-content\/uploads\/2022\/09\/Semicon-Europa-Peter-C-300x171.jpg 300w, \/wp-content\/uploads\/2022\/09\/Semicon-Europa-Peter-C-1030x589.jpg 1030w, \/wp-content\/uploads\/2022\/09\/Semicon-Europa-Peter-C-768x439.jpg 768w, \/wp-content\/uploads\/2022\/09\/Semicon-Europa-Peter-C-1536x878.jpg 1536w, \/wp-content\/uploads\/2022\/09\/Semicon-Europa-Peter-C-2048x1170.jpg 2048w, \/wp-content\/uploads\/2022\/09\/Semicon-Europa-Peter-C-1500x857.jpg 1500w, \/wp-content\/uploads\/2022\/09\/Semicon-Europa-Peter-C-705x403.jpg 705w\" sizes=\"auto, (max-width: 300px) 100vw, 300px\" \/><strong>Evolution of 55 GHz Octal-site Wafer Test Probe Card for 5G mmWave devices<\/strong> | Peter Cockburn<br \/>\nOne of the most demanding test applications today is high volume production wafer test of 5G mmWave devices at speed. In this presentation Peter Cockburn discusses how mmWave interfaces operating at 55 GHz require impedance matching to 35 Ohms. RF simulation of the complete probe head and PCB signal paths was used to define a new design that met expected performance goals. Implementation required a new probe-head cross section with a custom ground probe and modified PCB trace structures on surface and embedded layers. This paper was presented at SWTest 2022.<\/p>\n<p>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-16g9ybg-632243c78893649d6e17f8a56c596270\">\n#top .hr.hr-invisible.av-16g9ybg-632243c78893649d6e17f8a56c596270{\nheight:20px;\n}\n<\/style>\n<div  class='hr av-16g9ybg-632243c78893649d6e17f8a56c596270 hr-invisible  avia-builder-el-55  el_before_av_button  avia-builder-el-first '><span class='hr-inner '><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<div  class='avia-button-wrap av-1djt75o-a0914ec6fc77ef0f1ed81164df28cf73-wrap avia-button-left  avia-builder-el-56  el_after_av_hr  avia-builder-el-last '>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-1djt75o-a0914ec6fc77ef0f1ed81164df28cf73\">\n#top #wrap_all .avia-button.av-1djt75o-a0914ec6fc77ef0f1ed81164df28cf73:hover{\nbackground-color:grey;\ncolor:white;\ntransition:all 0.4s ease-in-out;\n}\n#top #wrap_all .avia-button.av-1djt75o-a0914ec6fc77ef0f1ed81164df28cf73:hover .avia-svg-icon svg:first-child{\nfill:white;\nstroke:white;\n}\n<\/style>\n<a href='https:\/\/youtu.be\/_kDFUCvKiww'  class='avia-button av-1djt75o-a0914ec6fc77ef0f1ed81164df28cf73 av-link-btn avia-icon_select-yes-left-icon avia-size-medium avia-position-left avia-color-theme-color avia-font-color-theme-color'  target=\"_blank\"  rel=\"noopener noreferrer\"  aria-label=\"Watch on YouTube Channel\"><span class='avia_button_icon avia_button_icon_left avia-iconfont avia-font-entypo-fontello' data-av_icon='\ue80d' data-av_iconfont='entypo-fontello' ><\/span><span class='avia_iconbox_title' >Watch on YouTube Channel<\/span><\/a><\/div><br \/>\n<\/header>\n<\/div>\n<div><\/div>\n<div><\/div>\n<\/div><\/section><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-sot0os-1a7a7f0352ef4c166b5732244973c0c9\">\n#top .hr.av-sot0os-1a7a7f0352ef4c166b5732244973c0c9{\nmargin-top:2px;\nmargin-bottom:2px;\n}\n.hr.av-sot0os-1a7a7f0352ef4c166b5732244973c0c9 .hr-inner{\nwidth:50px;\n}\n<\/style>\n<div  class='hr av-sot0os-1a7a7f0352ef4c166b5732244973c0c9 hr-custom  avia-builder-el-57  el_after_av_textblock  el_before_av_textblock  hr-center hr-icon-no'><span class='hr-inner inner-border-av-border-none'><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<section  class='av_textblock_section av-l5js699i-a890d47239b0cc1bc1065e2b48a3d951 '   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><div>\n<header><img loading=\"lazy\" decoding=\"async\" class=\"wp-image-38914 size-medium alignleft\" src=\"\/wp-content\/uploads\/2021\/12\/Cohu-Semicon-Korea-2022-300x171.jpg\" alt=\"Cohu Semicon Korea 2022\" width=\"300\" height=\"171\" srcset=\"\/wp-content\/uploads\/2021\/12\/Cohu-Semicon-Korea-2022-300x171.jpg 300w, \/wp-content\/uploads\/2021\/12\/Cohu-Semicon-Korea-2022-1030x589.jpg 1030w, \/wp-content\/uploads\/2021\/12\/Cohu-Semicon-Korea-2022-768x439.jpg 768w, \/wp-content\/uploads\/2021\/12\/Cohu-Semicon-Korea-2022-1536x878.jpg 1536w, \/wp-content\/uploads\/2021\/12\/Cohu-Semicon-Korea-2022-2048x1170.jpg 2048w, \/wp-content\/uploads\/2021\/12\/Cohu-Semicon-Korea-2022-1500x857.jpg 1500w, \/wp-content\/uploads\/2021\/12\/Cohu-Semicon-Korea-2022-705x403.jpg 705w\" sizes=\"auto, (max-width: 300px) 100vw, 300px\" \/><a href=\"https:\/\/www.youtube.com\/watch?v=WTGWrVWAKm4\" rel=\"noopener\"><strong>Addressing Test Cell Challenges to Accelerate Time to Yield<\/strong><\/a>\u00a0| Ian Lawee<br \/>\n<span class=\"style-scope yt-formatted-string\" dir=\"auto\">The time pressure to develop and aggressively ramp new products at high yield is increasing across all semiconductor segments. In this presentation, Ian Lawee will outline these time to yield challenges. He also explains how Cohu&#8217;s test cell first approach creates more flexible test cell solutions to be targeted at multiple device technologies which can shorten the cycle time to first-pass success for a portfolio of devices at high throughput and yield.<\/span> This paper was presented at Semicon Korea 2022.<\/p>\n<p>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-rc1m8s-06cee0d4c4c270edb926d30e54aa0155\">\n#top .hr.hr-invisible.av-rc1m8s-06cee0d4c4c270edb926d30e54aa0155{\nheight:20px;\n}\n<\/style>\n<div  class='hr av-rc1m8s-06cee0d4c4c270edb926d30e54aa0155 hr-invisible  avia-builder-el-59  el_before_av_button  avia-builder-el-first '><span class='hr-inner '><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<div  class='avia-button-wrap av-vgy4n0-7a1b4195bbbb76defa5cd1f0c9eba4c3-wrap avia-button-left  avia-builder-el-60  el_after_av_hr  avia-builder-el-last '>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-vgy4n0-7a1b4195bbbb76defa5cd1f0c9eba4c3\">\n#top #wrap_all .avia-button.av-vgy4n0-7a1b4195bbbb76defa5cd1f0c9eba4c3:hover{\nbackground-color:grey;\ncolor:white;\ntransition:all 0.4s ease-in-out;\n}\n#top #wrap_all .avia-button.av-vgy4n0-7a1b4195bbbb76defa5cd1f0c9eba4c3:hover .avia-svg-icon svg:first-child{\nfill:white;\nstroke:white;\n}\n<\/style>\n<a href='https:\/\/youtu.be\/WTGWrVWAKm4'  class='avia-button av-vgy4n0-7a1b4195bbbb76defa5cd1f0c9eba4c3 av-link-btn avia-icon_select-yes-left-icon avia-size-medium avia-position-left avia-color-theme-color avia-font-color-theme-color'  target=\"_blank\"  rel=\"noopener noreferrer\"  aria-label=\"Watch on YouTube Channel\"><span class='avia_button_icon avia_button_icon_left avia-iconfont avia-font-entypo-fontello' data-av_icon='\ue80d' data-av_iconfont='entypo-fontello' ><\/span><span class='avia_iconbox_title' >Watch on YouTube Channel<\/span><\/a><\/div><br \/>\n<\/header>\n<\/div>\n<div><\/div>\n<div><\/div>\n<\/div><\/section><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-jwubo352-af13759e8c6a1379615b35205f3199b2\">\n#top .hr.av-jwubo352-af13759e8c6a1379615b35205f3199b2{\nmargin-top:2px;\nmargin-bottom:2px;\n}\n.hr.av-jwubo352-af13759e8c6a1379615b35205f3199b2 .hr-inner{\nwidth:50px;\n}\n<\/style>\n<div  class='hr av-jwubo352-af13759e8c6a1379615b35205f3199b2 hr-custom  avia-builder-el-61  el_after_av_textblock  el_before_av_heading  hr-center hr-icon-no'><span class='hr-inner inner-border-av-border-none'><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-19hepi4-b9da535074b7033f0dc44cd5b20dd617\">\n#top .av-special-heading.av-19hepi4-b9da535074b7033f0dc44cd5b20dd617{\npadding-bottom:10px;\n}\nbody .av-special-heading.av-19hepi4-b9da535074b7033f0dc44cd5b20dd617 .av-special-heading-tag .heading-char{\nfont-size:25px;\n}\n.av-special-heading.av-19hepi4-b9da535074b7033f0dc44cd5b20dd617 .av-subheading{\nfont-size:15px;\n}\n<\/style>\n<div  class='av-special-heading av-19hepi4-b9da535074b7033f0dc44cd5b20dd617 av-special-heading-h3  avia-builder-el-62  el_after_av_hr  el_before_av_hr '><h3 class='av-special-heading-tag '  itemprop=\"headline\"  >2021<\/h3><div class=\"special-heading-border\"><div class=\"special-heading-inner-border\"><\/div><\/div><\/div><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-l2gh4s-19898c520f4eb9d8e107fd7c070c6b2e\">\n#top .hr.av-l2gh4s-19898c520f4eb9d8e107fd7c070c6b2e{\nmargin-top:1px;\nmargin-bottom:1px;\n}\n.hr.av-l2gh4s-19898c520f4eb9d8e107fd7c070c6b2e .hr-inner{\nwidth:50px;\n}\n<\/style>\n<div  class='hr av-l2gh4s-19898c520f4eb9d8e107fd7c070c6b2e hr-custom  avia-builder-el-63  el_after_av_heading  el_before_av_textblock  hr-center hr-icon-no'><span class='hr-inner inner-border-av-border-none'><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<section  class='av_textblock_section av-n66ta4-e4d18f3cc1f8225e2eddc3fde82c0125 '   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><div>\n<header><a href=\"\/wp-content\/uploads\/2022\/09\/Cohu_TestConX2021_Lonks.pdf\" target=\"_blank\" rel=\"noopener\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft wp-image-33030\" src=\"\/wp-content\/uploads\/2020\/12\/aerial-view-of-city-network-of-beijing-skyline-picture-id8915018761-180x180.jpg\" alt=\"Cohu Mobility Market Solutions\" width=\"110\" height=\"110\" srcset=\"\/wp-content\/uploads\/2020\/12\/aerial-view-of-city-network-of-beijing-skyline-picture-id8915018761-180x180.jpg 180w, \/wp-content\/uploads\/2020\/12\/aerial-view-of-city-network-of-beijing-skyline-picture-id8915018761-80x80.jpg 80w, \/wp-content\/uploads\/2020\/12\/aerial-view-of-city-network-of-beijing-skyline-picture-id8915018761-36x36.jpg 36w, \/wp-content\/uploads\/2020\/12\/aerial-view-of-city-network-of-beijing-skyline-picture-id8915018761-120x120.jpg 120w, \/wp-content\/uploads\/2020\/12\/aerial-view-of-city-network-of-beijing-skyline-picture-id8915018761-450x450.jpg 450w\" sizes=\"auto, (max-width: 110px) 100vw, 110px\" \/><\/a><a href=\"\/wp-content\/uploads\/2022\/09\/Cohu_TestConX2021_Lonks.pdf\" target=\"_blank\" rel=\"noopener\"><strong>Innovations in Package Testing of 5G mmWave Applications<\/strong> <\/a>| Aaren Lonks | Don Thompson of R&amp;D Altanova<br \/>\n5G mmWave <span class=\"break-words\"><span dir=\"ltr\">has a huge impact on the test environment and is revolutionary from a design and implementation standpoint. Learn how the interface for testing 5G mmWave devices must be designed to allow 44 GHz+ signal transmission with minimal loss from the ATE tester to the DUT.<\/span><\/span> This paper was presented at TestConX 2021.<\/header>\n<\/div>\n<div><\/div>\n<div><\/div>\n<\/div><\/section><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-jwubo352-6-f5eca9efd47a68f38b4648048e5301a1\">\n#top .hr.av-jwubo352-6-f5eca9efd47a68f38b4648048e5301a1{\nmargin-top:1px;\nmargin-bottom:1px;\n}\n.hr.av-jwubo352-6-f5eca9efd47a68f38b4648048e5301a1 .hr-inner{\nwidth:50px;\n}\n<\/style>\n<div  class='hr av-jwubo352-6-f5eca9efd47a68f38b4648048e5301a1 hr-custom  avia-builder-el-65  el_after_av_textblock  el_before_av_textblock  hr-center hr-icon-no'><span class='hr-inner inner-border-av-border-none'><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<section  class='av_textblock_section av-kolnraak-e084f46703a0a1a9fd171d34cbb958ad '   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><div>\n<header><a href=\"\/wp-content\/uploads\/2022\/09\/Cohu_TestConX2021_Mroczkowski.pdf\" target=\"_blank\" rel=\"noopener\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft wp-image-27183\" src=\"\/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024-300x300.jpg\" alt=\"\" width=\"110\" height=\"110\" srcset=\"\/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024-300x300.jpg 300w, \/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024-80x80.jpg 80w, \/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024-768x768.jpg 768w, \/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024-36x36.jpg 36w, \/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024-180x180.jpg 180w, \/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024-705x705.jpg 705w, \/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024-120x120.jpg 120w, \/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024-450x450.jpg 450w, \/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024-50x50.jpg 50w, \/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024-150x150.jpg 150w, \/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024.jpg 1024w\" sizes=\"auto, (max-width: 110px) 100vw, 110px\" \/><\/a><a href=\"\/wp-content\/uploads\/2022\/09\/Cohu_TestConX2021_Mroczkowski.pdf\" target=\"_blank\" rel=\"noopener\"><strong>Production Wafer Probe of 77-81 GHz Automotive Radar Applications<\/strong> <\/a>| Marty Cavegn | Jason Mroczkowski | Jory Twitchell of NXP<br \/>\n<span class=\"break-words\"><span dir=\"ltr\">Second generation 80 GHz automotive devices are reaching the high-volume production test environment. Learn how an interface solution was developed to test second-generation automotive radar by terminating the 80 GHz signals inside the probe head, as well as provide a path for sourcing a DC voltage to the DUT. <\/span><\/span> This paper was presented at TestConX 2021.<\/header>\n<\/div>\n<div><\/div>\n<div><\/div>\n<\/div><\/section><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-zhi6bg-f0eb13bea4df75d25ca115604043f2d5\">\n#top .hr.av-zhi6bg-f0eb13bea4df75d25ca115604043f2d5{\nmargin-top:1px;\nmargin-bottom:1px;\n}\n.hr.av-zhi6bg-f0eb13bea4df75d25ca115604043f2d5 .hr-inner{\nwidth:50px;\n}\n<\/style>\n<div  class='hr av-zhi6bg-f0eb13bea4df75d25ca115604043f2d5 hr-custom  avia-builder-el-67  el_after_av_textblock  el_before_av_textblock  hr-center hr-icon-no'><span class='hr-inner inner-border-av-border-none'><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<section  class='av_textblock_section av-jwubn2ty-8-6dad0edc491a7374e674b6c2cfe7c4b4 '   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><div>\n<header><a href=\"\/wp-content\/uploads\/2022\/09\/Cohu_MEPTEC_2021_JT.pdf\" target=\"_blank\" rel=\"noopener\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft wp-image-34500\" src=\"\/wp-content\/uploads\/2021\/03\/Computing-and-Network-1024-x-1024-300x300.jpg\" alt=\"\" width=\"110\" height=\"110\" srcset=\"\/wp-content\/uploads\/2021\/03\/Computing-and-Network-1024-x-1024-300x300.jpg 300w, \/wp-content\/uploads\/2021\/03\/Computing-and-Network-1024-x-1024-80x80.jpg 80w, \/wp-content\/uploads\/2021\/03\/Computing-and-Network-1024-x-1024-36x36.jpg 36w, \/wp-content\/uploads\/2021\/03\/Computing-and-Network-1024-x-1024-180x180.jpg 180w, \/wp-content\/uploads\/2021\/03\/Computing-and-Network-1024-x-1024-120x120.jpg 120w, \/wp-content\/uploads\/2021\/03\/Computing-and-Network-1024-x-1024.jpg 342w\" sizes=\"auto, (max-width: 110px) 100vw, 110px\" \/><\/a><a href=\"\/wp-content\/uploads\/2022\/09\/Cohu_MEPTEC_2021_JT.pdf\" target=\"_blank\" rel=\"noopener\"><strong>Thermal Control Challenges of High Power DUTs during Test<\/strong> <\/a>| Jerry Tustaniwskyj |<br \/>\nThis paper <span class=\"break-words\"><span dir=\"ltr\">explains how Cohu\u2019s adaptive thermal management capability (T-Core) enables testing devices at the intended temperature. <\/span><\/span>This paper was presented at MEPTEC 2021.<\/header>\n<\/div>\n<div><\/div>\n<div><\/div>\n<\/div><\/section><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-1o3jgsc-bee179f1f26cb56fe8c09ca7c198ca3b\">\n#top .hr.av-1o3jgsc-bee179f1f26cb56fe8c09ca7c198ca3b{\nmargin-top:1px;\nmargin-bottom:1px;\n}\n.hr.av-1o3jgsc-bee179f1f26cb56fe8c09ca7c198ca3b .hr-inner{\nwidth:50px;\n}\n<\/style>\n<div  class='hr av-1o3jgsc-bee179f1f26cb56fe8c09ca7c198ca3b hr-custom  avia-builder-el-69  el_after_av_textblock  avia-builder-el-last  hr-center hr-icon-no'><span class='hr-inner inner-border-av-border-none'><span class=\"hr-inner-style\"><\/span><\/span><\/div><\/p><\/div>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-bny3x5o-4a53682c4899c8bc61b7f69d3f962178\">\n.flex_column.av-bny3x5o-4a53682c4899c8bc61b7f69d3f962178{\nborder-radius:0px 0px 0px 0px;\npadding:0px 0px 0px 0px;\n}\n<\/style>\n<div  class='flex_column av-bny3x5o-4a53682c4899c8bc61b7f69d3f962178 av_two_fifth  avia-builder-el-70  el_after_av_one_full  el_before_av_three_fifth  first flex_column_div av-zero-column-padding  column-top-margin'     ><section  class='av_textblock_section av-koopg961-849c3950da8ee8b150d770f487e64371 '   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><div>\n<header><img loading=\"lazy\" decoding=\"async\" class=\"wp-image-33030 alignleft\" src=\"\/wp-content\/uploads\/2020\/12\/aerial-view-of-city-network-of-beijing-skyline-picture-id8915018761-80x80.jpg\" alt=\"Cohu Mobility Market Solutions\" width=\"110\" height=\"110\" srcset=\"\/wp-content\/uploads\/2020\/12\/aerial-view-of-city-network-of-beijing-skyline-picture-id8915018761-80x80.jpg 80w, \/wp-content\/uploads\/2020\/12\/aerial-view-of-city-network-of-beijing-skyline-picture-id8915018761-36x36.jpg 36w, \/wp-content\/uploads\/2020\/12\/aerial-view-of-city-network-of-beijing-skyline-picture-id8915018761-180x180.jpg 180w, \/wp-content\/uploads\/2020\/12\/aerial-view-of-city-network-of-beijing-skyline-picture-id8915018761-120x120.jpg 120w, \/wp-content\/uploads\/2020\/12\/aerial-view-of-city-network-of-beijing-skyline-picture-id8915018761-450x450.jpg 450w\" sizes=\"auto, (max-width: 110px) 100vw, 110px\" \/><span style=\"color: #0053a1;\"><strong>cRacer Concept &#8211; Achieving 54+ GHz <\/strong><\/span><\/header>\n<header>Peter Cockburn | Jason Mroczkowski |<br \/>\nA <span class=\"break-words\"><span dir=\"ltr\">technique to combine traditional spring probe technology with a dielectric-optimized socket architecture to reach 54+ GHz frequencies and deliver high yield with low cost-of-test.\u00a0 Presented at TestConX 2021.<br \/>\n<\/span><\/span><\/header>\n<\/div>\n<div><\/div>\n<div><\/div>\n<\/div><\/section><\/div><\/p>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-bfvqtfg-dee2a90f320f5ddd24a1c914b171bc79\">\n.flex_column.av-bfvqtfg-dee2a90f320f5ddd24a1c914b171bc79{\nborder-radius:0px 0px 0px 0px;\npadding:0px 0px 0px 0px;\n}\n<\/style>\n<div  class='flex_column av-bfvqtfg-dee2a90f320f5ddd24a1c914b171bc79 av_three_fifth  avia-builder-el-72  el_after_av_two_fifth  el_before_av_one_full  flex_column_div av-zero-column-padding  column-top-margin'     ><section  class='av_textblock_section av-koopcqc2-1233234e07c5d55ecb7f8682398ec4cd '   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><p><iframe loading=\"lazy\" src=\"https:\/\/player.vimeo.com\/video\/530430440\" width=\"640\" height=\"360\" frameborder=\"0\" allowfullscreen=\"allowfullscreen\"><\/iframe><\/p>\n<\/div><\/section><\/div>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-aqfkzr0-c5999a4f3ab4ba9295bdfb5ec8e7089b\">\n.flex_column.av-aqfkzr0-c5999a4f3ab4ba9295bdfb5ec8e7089b{\nborder-radius:0px 0px 0px 0px;\npadding:0px 0px 0px 0px;\n}\n<\/style>\n<div  class='flex_column av-aqfkzr0-c5999a4f3ab4ba9295bdfb5ec8e7089b av_one_full  avia-builder-el-74  el_after_av_three_fifth  el_before_av_hr  first flex_column_div av-zero-column-padding  '     ><p>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-a6jcj0c-6c23f2d9fe3322a55a05339f623b17ad\">\n#top .av-special-heading.av-a6jcj0c-6c23f2d9fe3322a55a05339f623b17ad{\npadding-bottom:10px;\n}\nbody .av-special-heading.av-a6jcj0c-6c23f2d9fe3322a55a05339f623b17ad .av-special-heading-tag .heading-char{\nfont-size:25px;\n}\n.av-special-heading.av-a6jcj0c-6c23f2d9fe3322a55a05339f623b17ad .av-subheading{\nfont-size:15px;\n}\n<\/style>\n<div  class='av-special-heading av-a6jcj0c-6c23f2d9fe3322a55a05339f623b17ad av-special-heading-h3  avia-builder-el-75  el_before_av_hr  avia-builder-el-first '><h3 class='av-special-heading-tag '  itemprop=\"headline\"  >2020<\/h3><div class=\"special-heading-border\"><div class=\"special-heading-inner-border\"><\/div><\/div><\/div><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-zau4cc-62b1bf3f9e67aa86c5b48d09efc7c8b4\">\n#top .hr.av-zau4cc-62b1bf3f9e67aa86c5b48d09efc7c8b4{\nmargin-top:1px;\nmargin-bottom:1px;\n}\n.hr.av-zau4cc-62b1bf3f9e67aa86c5b48d09efc7c8b4 .hr-inner{\nwidth:50px;\n}\n<\/style>\n<div  class='hr av-zau4cc-62b1bf3f9e67aa86c5b48d09efc7c8b4 hr-custom  avia-builder-el-76  el_after_av_heading  el_before_av_textblock  hr-center hr-icon-no'><span class='hr-inner inner-border-av-border-none'><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<section  class='av_textblock_section av-ydqf3w-0c20b5a4d554b337c446ab9738d96efa '   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><div>\n<header><a href=\"\/wp-content\/uploads\/2022\/09\/TestConX2020-presentation-Jason-Mroczkowski.pdf\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft wp-image-29776\" src=\"\/wp-content\/uploads\/2020\/07\/Tech-paper_Matching-Production.jpg\" alt=\"\" width=\"112\" height=\"112\" srcset=\"\/wp-content\/uploads\/2020\/07\/Tech-paper_Matching-Production.jpg 180w, \/wp-content\/uploads\/2020\/07\/Tech-paper_Matching-Production-80x80.jpg 80w, \/wp-content\/uploads\/2020\/07\/Tech-paper_Matching-Production-36x36.jpg 36w, \/wp-content\/uploads\/2020\/07\/Tech-paper_Matching-Production-120x120.jpg 120w\" sizes=\"auto, (max-width: 112px) 100vw, 112px\" \/><\/a><a href=\"\/wp-content\/uploads\/2022\/09\/TestConX2020-presentation-Jason-Mroczkowski.pdf\" target=\"_blank\" rel=\"noopener\"><strong>Matching the production environment with in-house testing<\/strong><\/a> | Jason Mroczkowski |<br \/>\nThis presentation delivered at TestConX2020 will define the next-generation test methodology and equipment for validating interface hardware during the product development phase. A more sophisticated method of test will be introduced in this presentation. This includes the usage of handling equipment to provide a true high volume production environment in the lab. The methodology introduced here allows many environment variables to be tested simultaneously. No longer is it necessary to cycle and test with different equipment.<\/header>\n<\/div>\n<div><\/div>\n<div><\/div>\n<\/div><\/section><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-927rl0c-b0b433ea91b035a7e1b1f8026e42cfdc\">\n#top .hr.av-927rl0c-b0b433ea91b035a7e1b1f8026e42cfdc{\nmargin-top:1px;\nmargin-bottom:1px;\n}\n.hr.av-927rl0c-b0b433ea91b035a7e1b1f8026e42cfdc .hr-inner{\nwidth:50px;\n}\n<\/style>\n<div  class='hr av-927rl0c-b0b433ea91b035a7e1b1f8026e42cfdc hr-custom  avia-builder-el-78  el_after_av_textblock  el_before_av_textblock  hr-center hr-icon-no'><span class='hr-inner inner-border-av-border-none'><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<section  class='av_textblock_section av-8ondph8-63e1a60aa3a4582efda0e3dca3a0b3e3 '   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><div>\n<header><a href=\"\/wp-content\/uploads\/2022\/09\/TestConX-2020-OTA-5G-mmWave-Yukang-Dylan-Feng.pdf\" target=\"_blank\" rel=\"noopener\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft wp-image-29679\" src=\"\/wp-content\/uploads\/2020\/06\/5G-City-crop_electronic.jpg\" alt=\"5G city \" width=\"112\" height=\"112\" srcset=\"\/wp-content\/uploads\/2020\/06\/5G-City-crop_electronic.jpg 180w, \/wp-content\/uploads\/2020\/06\/5G-City-crop_electronic-80x80.jpg 80w, \/wp-content\/uploads\/2020\/06\/5G-City-crop_electronic-36x36.jpg 36w, \/wp-content\/uploads\/2020\/06\/5G-City-crop_electronic-120x120.jpg 120w\" sizes=\"auto, (max-width: 112px) 100vw, 112px\" \/><\/a><a href=\"\/wp-content\/uploads\/2022\/09\/TestConX-2020-OTA-5G-mmWave-Yukang-Dylan-Feng.pdf\" target=\"_blank\" rel=\"noopener\"><strong>OTA Test Solution for 5G \/ mmWave Band Wireless ICs<\/strong> <\/a>| Dylan Feng |<br \/>\nWinner of Attendee Choice Award at TestConX 2020. The emerging 5G market creates enormous opportunities for the wireless IC industry. Meanwhile, providing OTA test solution in the new 5G frequency band is recognized as an important requirement. In this paper, a new generation OTA test solution is presented.<\/header>\n<\/div>\n<div><\/div>\n<div><\/div>\n<\/div><\/section><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-7xf5n3w-98515c72bbca05fb80924a6396525488\">\n#top .hr.av-7xf5n3w-98515c72bbca05fb80924a6396525488{\nmargin-top:1px;\nmargin-bottom:1px;\n}\n.hr.av-7xf5n3w-98515c72bbca05fb80924a6396525488 .hr-inner{\nwidth:50px;\n}\n<\/style>\n<div  class='hr av-7xf5n3w-98515c72bbca05fb80924a6396525488 hr-custom  avia-builder-el-80  el_after_av_textblock  el_before_av_heading  hr-center hr-icon-no'><span class='hr-inner inner-border-av-border-none'><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-7knvv24-97deffc63b249d73f6b695c1b0377521\">\n#top .av-special-heading.av-7knvv24-97deffc63b249d73f6b695c1b0377521{\npadding-bottom:10px;\n}\nbody .av-special-heading.av-7knvv24-97deffc63b249d73f6b695c1b0377521 .av-special-heading-tag .heading-char{\nfont-size:25px;\n}\n.av-special-heading.av-7knvv24-97deffc63b249d73f6b695c1b0377521 .av-subheading{\nfont-size:15px;\n}\n<\/style>\n<div  class='av-special-heading av-7knvv24-97deffc63b249d73f6b695c1b0377521 av-special-heading-h3  avia-builder-el-81  el_after_av_hr  el_before_av_textblock '><h3 class='av-special-heading-tag '  itemprop=\"headline\"  >2019<\/h3><div class=\"special-heading-border\"><div class=\"special-heading-inner-border\"><\/div><\/div><\/div><br \/>\n<section  class='av_textblock_section av-74g6hks-83117332774a1c790912d59ba4089896 '   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><div>\n<header><a href=\"\/wp-content\/uploads\/2022\/09\/OTA-Test-Solution-for-High-Volume-Production-Test-of-AiP-devices.pdf\" target=\"_blank\" rel=\"noopener\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft wp-image-25824\" src=\"\/wp-content\/uploads\/2019\/06\/RF-Test-180x180.jpg\" alt=\"\" width=\"112\" height=\"112\" srcset=\"\/wp-content\/uploads\/2019\/06\/RF-Test-180x180.jpg 180w, \/wp-content\/uploads\/2019\/06\/RF-Test-180x180-80x80.jpg 80w, \/wp-content\/uploads\/2019\/06\/RF-Test-180x180-36x36.jpg 36w, \/wp-content\/uploads\/2019\/06\/RF-Test-180x180-120x120.jpg 120w, \/wp-content\/uploads\/2019\/06\/RF-Test-180x180-50x50.jpg 50w, \/wp-content\/uploads\/2019\/06\/RF-Test-180x180-150x150.jpg 150w\" sizes=\"auto, (max-width: 112px) 100vw, 112px\" \/><\/a><a href=\"\/wp-content\/uploads\/2022\/09\/OTA-Test-Solution-for-High-Volume-Production-Test-of-AiP-devices.pdf\" target=\"_blank\" rel=\"noopener\"><strong>OTA Test Solution for High Volume Production Test of AiP Devices<\/strong>\u00a0<\/a>| Jason Mroczkowski |<br \/>\nThe variety of 5G Antenna in Package (AiP) devices and integrated antenna module pose unique challenges to the production test cell. Test requirements call for Over the Air (OTA) test solution in the mmWave (30 GHz &#8211; 100 GHz) frequency bands while most existing OTA solutions are designed only for the lab environment.<\/header>\n<\/div>\n<div><\/div>\n<div><\/div>\n<\/div><\/section><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-6v4g5jw-6edc91fcbb288b4c8ac8745ea061e22c\">\n#top .hr.av-6v4g5jw-6edc91fcbb288b4c8ac8745ea061e22c{\nmargin-top:1px;\nmargin-bottom:1px;\n}\n.hr.av-6v4g5jw-6edc91fcbb288b4c8ac8745ea061e22c .hr-inner{\nwidth:50px;\n}\n<\/style>\n<div  class='hr av-6v4g5jw-6edc91fcbb288b4c8ac8745ea061e22c hr-custom  avia-builder-el-83  el_after_av_textblock  el_before_av_textblock  hr-center hr-icon-no'><span class='hr-inner inner-border-av-border-none'><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<section  class='av_textblock_section av-6buyg4c-28276330a2f1b9fdd3f4cb5d4f7fcc7c '   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><div>\n<header><a href=\"\/wp-content\/uploads\/2022\/09\/On-chip-Test-with-Microstrip-Patch-Antennas.pdf\" target=\"_blank\" rel=\"noopener\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft wp-image-27183\" src=\"\/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024-300x300.jpg\" alt=\"\" width=\"110\" height=\"110\" srcset=\"\/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024-300x300.jpg 300w, \/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024-80x80.jpg 80w, \/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024-768x768.jpg 768w, \/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024-36x36.jpg 36w, \/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024-180x180.jpg 180w, \/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024-705x705.jpg 705w, \/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024-120x120.jpg 120w, \/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024-450x450.jpg 450w, \/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024-50x50.jpg 50w, \/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024-150x150.jpg 150w, \/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024.jpg 1024w\" sizes=\"auto, (max-width: 110px) 100vw, 110px\" \/><\/a><a href=\"\/wp-content\/uploads\/2022\/09\/On-chip-Test-with-Microstrip-Patch-Antennas.pdf\" target=\"_blank\" rel=\"noopener\"><strong>On-chip Test with Microstrip Patch Antennas<\/strong> <\/a>| Dan Campion |<br \/>\nThis paper presents a perspective of the development of microstrip antennas for use in WLCSP and WLP semiconductor test. The work that will be discussed includes designing, manufacturing, and installing microstrip patch antenna in contactors and probe heads for test.<\/header>\n<\/div>\n<div><\/div>\n<div><\/div>\n<\/div><\/section><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-5th2uws-62178c98e545b40e4f347ae2469f3990\">\n#top .hr.av-5th2uws-62178c98e545b40e4f347ae2469f3990{\nmargin-top:1px;\nmargin-bottom:1px;\n}\n.hr.av-5th2uws-62178c98e545b40e4f347ae2469f3990 .hr-inner{\nwidth:50px;\n}\n<\/style>\n<div  class='hr av-5th2uws-62178c98e545b40e4f347ae2469f3990 hr-custom  avia-builder-el-85  el_after_av_textblock  el_before_av_textblock  hr-center hr-icon-no'><span class='hr-inner inner-border-av-border-none'><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<section  class='av_textblock_section av-5czb9b0-7c34685f3d2eec17b957af2f9d91c56f '   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><div>\n<header><a href=\"\/wp-content\/uploads\/2022\/09\/WLCSP-xWave-for-high-frequency-wafer-probe-applications-part-2.pdf\" target=\"_blank\" rel=\"noopener\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft wp-image-27180\" src=\"\/wp-content\/uploads\/2019\/06\/Wireless-RF-1024-x-1024-300x300.jpg\" alt=\"\" width=\"110\" height=\"110\" srcset=\"\/wp-content\/uploads\/2019\/06\/Wireless-RF-1024-x-1024-300x300.jpg 300w, \/wp-content\/uploads\/2019\/06\/Wireless-RF-1024-x-1024-80x80.jpg 80w, \/wp-content\/uploads\/2019\/06\/Wireless-RF-1024-x-1024-768x768.jpg 768w, \/wp-content\/uploads\/2019\/06\/Wireless-RF-1024-x-1024-36x36.jpg 36w, \/wp-content\/uploads\/2019\/06\/Wireless-RF-1024-x-1024-180x180.jpg 180w, \/wp-content\/uploads\/2019\/06\/Wireless-RF-1024-x-1024-705x705.jpg 705w, \/wp-content\/uploads\/2019\/06\/Wireless-RF-1024-x-1024-120x120.jpg 120w, \/wp-content\/uploads\/2019\/06\/Wireless-RF-1024-x-1024-450x450.jpg 450w, \/wp-content\/uploads\/2019\/06\/Wireless-RF-1024-x-1024-50x50.jpg 50w, \/wp-content\/uploads\/2019\/06\/Wireless-RF-1024-x-1024-150x150.jpg 150w, \/wp-content\/uploads\/2019\/06\/Wireless-RF-1024-x-1024.jpg 1024w\" sizes=\"auto, (max-width: 110px) 100vw, 110px\" \/><\/a><a href=\"\/wp-content\/uploads\/2022\/09\/WLCSP-xWave-for-high-frequency-wafer-probe-applications-part-2.pdf\" target=\"_blank\" rel=\"noopener\"><strong>WLCSP xWave for high frequency wafer probe application part 2<\/strong><\/a> | Jason Mroczkowski |<br \/>\nToday cmWave (3-30 GHz) and mmWave (30-300 GHz) applications have become mainstream. Packaging has become obsolete and wafers are becoming the new final test package.<\/header>\n<\/div>\n<div><\/div>\n<\/div><\/section><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-4qdskbg-78ecf13d2b33936b5c22772a45fa4421\">\n#top .hr.av-4qdskbg-78ecf13d2b33936b5c22772a45fa4421{\nmargin-top:1px;\nmargin-bottom:1px;\n}\n.hr.av-4qdskbg-78ecf13d2b33936b5c22772a45fa4421 .hr-inner{\nwidth:50px;\n}\n<\/style>\n<div  class='hr av-4qdskbg-78ecf13d2b33936b5c22772a45fa4421 hr-custom  avia-builder-el-87  el_after_av_textblock  el_before_av_textblock  hr-center hr-icon-no'><span class='hr-inner inner-border-av-border-none'><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<section  class='av_textblock_section av-4hzvngc-6d3dd8aba624b9bc4fc56f71f549b0e8 '   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><div>\n<header><a href=\"\/wp-content\/uploads\/2022\/09\/Over-the-Air-Test-Solution-for-Antenna-in-Package-Applications.pdf\" target=\"_blank\" rel=\"noopener\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft wp-image-25824\" src=\"\/wp-content\/uploads\/2019\/06\/RF-Test-180x180.jpg\" alt=\"\" width=\"112\" height=\"112\" srcset=\"\/wp-content\/uploads\/2019\/06\/RF-Test-180x180.jpg 180w, \/wp-content\/uploads\/2019\/06\/RF-Test-180x180-80x80.jpg 80w, \/wp-content\/uploads\/2019\/06\/RF-Test-180x180-36x36.jpg 36w, \/wp-content\/uploads\/2019\/06\/RF-Test-180x180-120x120.jpg 120w, \/wp-content\/uploads\/2019\/06\/RF-Test-180x180-50x50.jpg 50w, \/wp-content\/uploads\/2019\/06\/RF-Test-180x180-150x150.jpg 150w\" sizes=\"auto, (max-width: 112px) 100vw, 112px\" \/><\/a><a href=\"\/wp-content\/uploads\/2022\/09\/Over-the-Air-Test-Solution-for-Antenna-in-Package-Applications.pdf\" target=\"_blank\" rel=\"noopener\"><strong>OTA Test Solution for Antenna in Package Applications<\/strong><\/a> | Jason Mroczkowski |<br \/>\nAs we step in 5G area, cell phone makers are turning to AIP ICs. Antenna in Package (or AiP) is a new trend in IC packaging which makes smaller and high integrated ICs that consists of ICs and antenna inside a package.<\/header>\n<\/div>\n<div><\/div>\n<\/div><\/section><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-42tdva4-474a4976002a2a249b90867ddadc18c1\">\n#top .hr.av-42tdva4-474a4976002a2a249b90867ddadc18c1{\nmargin-top:1px;\nmargin-bottom:1px;\n}\n.hr.av-42tdva4-474a4976002a2a249b90867ddadc18c1 .hr-inner{\nwidth:50px;\n}\n<\/style>\n<div  class='hr av-42tdva4-474a4976002a2a249b90867ddadc18c1 hr-custom  avia-builder-el-89  el_after_av_textblock  el_before_av_textblock  hr-center hr-icon-no'><span class='hr-inner inner-border-av-border-none'><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<section  class='av_textblock_section av-3agsm3g-2c1fddfcf478a76837dc973acee973a0 '   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><div>\n<header><a href=\"\/wp-content\/uploads\/2022\/09\/Closer-Tolerance-Thermal-Management-at-the-Device-Under-Test.pdf\" target=\"_blank\" rel=\"noopener\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft wp-image-27188\" src=\"\/wp-content\/uploads\/2019\/06\/IoT-1024-x-1024-300x300.jpg\" alt=\"\" width=\"110\" height=\"110\" srcset=\"\/wp-content\/uploads\/2019\/06\/IoT-1024-x-1024-300x300.jpg 300w, \/wp-content\/uploads\/2019\/06\/IoT-1024-x-1024-80x80.jpg 80w, \/wp-content\/uploads\/2019\/06\/IoT-1024-x-1024-768x768.jpg 768w, \/wp-content\/uploads\/2019\/06\/IoT-1024-x-1024-36x36.jpg 36w, \/wp-content\/uploads\/2019\/06\/IoT-1024-x-1024-180x180.jpg 180w, \/wp-content\/uploads\/2019\/06\/IoT-1024-x-1024-705x705.jpg 705w, \/wp-content\/uploads\/2019\/06\/IoT-1024-x-1024-120x120.jpg 120w, \/wp-content\/uploads\/2019\/06\/IoT-1024-x-1024-450x450.jpg 450w, \/wp-content\/uploads\/2019\/06\/IoT-1024-x-1024-50x50.jpg 50w, \/wp-content\/uploads\/2019\/06\/IoT-1024-x-1024-150x150.jpg 150w, \/wp-content\/uploads\/2019\/06\/IoT-1024-x-1024.jpg 1024w\" sizes=\"auto, (max-width: 110px) 100vw, 110px\" \/><\/a><a href=\"\/wp-content\/uploads\/2022\/09\/Closer-Tolerance-Thermal-Management-at-the-Device-Under-Test.pdf\" target=\"_blank\" rel=\"noopener\"><strong>Closer Tolerance Thermal Management at the Device-Under-Test<\/strong><\/a> | Mehdi Attaran |<br \/>\nEffective thermal management has become mandatory for testing devices with faster switching speed transistors that are increasing in numbers in smaller packages. These devices are dissipating more heat while being held at steady test temperature extremes.<\/header>\n<header><\/header>\n<\/div>\n<\/div><\/section><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-36nsrss-d803fe0099634f3d1afb978939b75fc9\">\n#top .hr.av-36nsrss-d803fe0099634f3d1afb978939b75fc9{\nmargin-top:1px;\nmargin-bottom:1px;\n}\n.hr.av-36nsrss-d803fe0099634f3d1afb978939b75fc9 .hr-inner{\nwidth:50px;\n}\n<\/style>\n<div  class='hr av-36nsrss-d803fe0099634f3d1afb978939b75fc9 hr-custom  avia-builder-el-91  el_after_av_textblock  el_before_av_textblock  hr-center hr-icon-no'><span class='hr-inner inner-border-av-border-none'><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<section  class='av_textblock_section av-1ms5d18-6e00f10383bc33b437e3cd13aa0b66d9 '   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><div>\n<header><a href=\"\/wp-content\/uploads\/2022\/09\/Spring-Probe-WLCSP-Probe-Head-CCC-ISMI-Characterization-Is-Not-Enough.pdf\" target=\"_blank\" rel=\"noopener\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft wp-image-25835\" src=\"\/wp-content\/uploads\/2019\/06\/Wafer-Level-Test-WLCP-Test.jpg\" alt=\"\" width=\"110\" height=\"110\" srcset=\"\/wp-content\/uploads\/2019\/06\/Wafer-Level-Test-WLCP-Test.jpg 200w, \/wp-content\/uploads\/2019\/06\/Wafer-Level-Test-WLCP-Test-80x80.jpg 80w, \/wp-content\/uploads\/2019\/06\/Wafer-Level-Test-WLCP-Test-36x36.jpg 36w, \/wp-content\/uploads\/2019\/06\/Wafer-Level-Test-WLCP-Test-180x180.jpg 180w, \/wp-content\/uploads\/2019\/06\/Wafer-Level-Test-WLCP-Test-120x120.jpg 120w, \/wp-content\/uploads\/2019\/06\/Wafer-Level-Test-WLCP-Test-50x50.jpg 50w, \/wp-content\/uploads\/2019\/06\/Wafer-Level-Test-WLCP-Test-150x150.jpg 150w\" sizes=\"auto, (max-width: 110px) 100vw, 110px\" \/><\/a><strong><a href=\"\/wp-content\/uploads\/2022\/09\/Spring-Probe-WLCSP-Probe-Head-CCC-ISMI-Characterization-Is-Not-Enough.pdf\" target=\"_blank\" rel=\"noopener\">Spring Probe WLCSP Probe Head CCC &#8211; ISMI Characterization is Not Enough<\/a><\/strong> | Valts Treibergs |<br \/>\nA recognized standard for evaluating the CCC (current carrying capacity) of an interconnect used at wafer probe has been the ISMI Probe Council Current Carrying Capability Measurement Guideline, published by International SEMATECH Manufacturing Initiative in 2009.<\/header>\n<header><\/header>\n<header><\/header>\n<\/div>\n<\/div><\/section><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-14xdscc-938a18fdb75dbe779fc169bd40195a77\">\n#top .hr.av-14xdscc-938a18fdb75dbe779fc169bd40195a77{\nmargin-top:1px;\nmargin-bottom:1px;\n}\n.hr.av-14xdscc-938a18fdb75dbe779fc169bd40195a77 .hr-inner{\nwidth:50px;\n}\n<\/style>\n<div  class='hr av-14xdscc-938a18fdb75dbe779fc169bd40195a77 hr-custom  avia-builder-el-93  el_after_av_textblock  el_before_av_textblock  hr-center hr-icon-no'><span class='hr-inner inner-border-av-border-none'><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<section  class='av_textblock_section av-wcz8zg-acc6048f43322c3e4d2dcf556d824ed0 '   itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><div>\n<header><a href=\"\/wp-content\/uploads\/2022\/09\/Solution-for-mmWave-Wafer-Probe-Applications-and-Field-Results.pdf\" target=\"_blank\" rel=\"noopener\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft wp-image-27183\" src=\"\/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024-300x300.jpg\" alt=\"\" width=\"110\" height=\"110\" srcset=\"\/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024-300x300.jpg 300w, \/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024-80x80.jpg 80w, \/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024-768x768.jpg 768w, \/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024-36x36.jpg 36w, \/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024-180x180.jpg 180w, \/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024-705x705.jpg 705w, \/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024-120x120.jpg 120w, \/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024-450x450.jpg 450w, \/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024-50x50.jpg 50w, \/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024-150x150.jpg 150w, \/wp-content\/uploads\/2019\/06\/Automotive-1024-x-1024.jpg 1024w\" sizes=\"auto, (max-width: 110px) 100vw, 110px\" \/><\/a><strong><a href=\"\/wp-content\/uploads\/2022\/09\/Solution-for-mmWave-Wafer-Probe-Applications-and-Field-Results.pdf\" target=\"_blank\" rel=\"noopener\">Solution for mmWave Wafer Probe Applications and Field Results<\/a><\/strong> | Jason Mroczkowski |<br \/>\nToday cmWave (3-30 GHz) and mmWave (30-300 GHz) applications have become mainstream. The wafer is becoming the new final test package. Testing automotive radar on wafer at 80 GHz and 150 \u00b0C was previously a fantasy, but is now a reality.<\/header>\n<header><\/header>\n<\/div>\n<\/div><\/section><\/p><\/div>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-jwubo352-5-fc83bfdd4fb4fd211adee2c961ff29c1\">\n#top .hr.av-jwubo352-5-fc83bfdd4fb4fd211adee2c961ff29c1{\nmargin-top:2px;\nmargin-bottom:2px;\n}\n.hr.av-jwubo352-5-fc83bfdd4fb4fd211adee2c961ff29c1 .hr-inner{\nwidth:50px;\n}\n<\/style>\n<div  class='hr av-jwubo352-5-fc83bfdd4fb4fd211adee2c961ff29c1 hr-custom  avia-builder-el-95  el_after_av_one_full  el_before_av_section  avia-builder-el-last  hr-center hr-icon-no'><span class='hr-inner inner-border-av-border-none'><span class=\"hr-inner-style\"><\/span><\/span><\/div>\n<\/div><\/div><\/div><!-- close content main div --><\/div><\/div>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" 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